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PSD813F1V
Flash In-System Programmable (ISP) Peripherals for 8-bit MCUs, 3.3V
FEATURES SUMMARY

DUAL BANK FLASH MEMORIES - 1 Mbit of Primary Flash Memory (8 Uniform Sectors) - 256 Kbit Secondary EEPROM (4 Uniform Sectors) - Concurrent operation: read from one memory while erasing and writing the other 16 Kbit SRAM (BATTERY-BACKED) PLD WITH MACROCELLS - Over 3,000 Gates Of PLD: DPLD and CPLD - DPLD - User-defined Internal chip-select decoding - CPLD with 16 Output Macrocells (OMCs) and 24 Input Macrocells (IMCs) 27 RECONFIGURABLE I/Os - 27 individually configurable I/O port pins that can be used for the following functions: MCU I/Os; PLD I/Os; Latched MCU address output; and Special function I/Os. Note: 16 of the I/O ports may be configured as open-drain outputs. ENHANCED JTAG SERIAL PORT - Built-in JTAG-compliant serial port allows full-chip In-System Programmability (ISP) - Efficient manufacturing allows for easy product testing and programming PAGE REGISTER - Internal page register that can be used to expand the microcontroller address space by a factor of 256. PROGRAMMABLE POWER MANAGEMENT
Figure 1. Packages
PQFP52 (M)
PLCC52 (J)
TQFQ64 (U)
HIGH ENDURANCE: - 100,000 Erase/WRITE Cycles of Flash Memory - 10,000 Erase/WRITE Cycles of EEPROM - 1,000 Erase/WRITE Cycles of PLD - Data Retention: 15-year minimum at 90C (for Main Flash, Boot, PLD and Configuration bits). SINGLE SUPPLY VOLTAGE: - 3.3V10% for PSD813F1V STANDBY CURRENT AS LOW AS 50A
June 2004
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TABLE OF CONTENTS
Features Summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 In-System Programming (ISP) via JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 In-Application Programming (IAP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PSDsoft Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 PSD ARCHITECTURAL OVERVIEW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Microcontroller Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 JTAG Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Page Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power Management Unit (PMU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 DEVELOPMENT SYSTEM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PSD Register Description and Address Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 DETAILED OPERATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 MEMORY BLOCKS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Primary Flash Memory and Secondary EEPROM Description . . . . . . . . . . . . . . . . . . . . . . . . . 18 Memory Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power-down Instruction and Power-up Mode . . READ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Data Polling Flag (DQ7). . . . . . . . . . . . . . . . . . . . . Toggle Flag (DQ6) . . . . . . . . . . . . . . . . . . . . . . . . . Error Flag (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . Erase Time-out Flag DQ3 (Flash Memory only) . Writing to the EEPROM. . . . . . . . . . . . . . . . . . . . . Writing the OTP Row . . . . . . . . . . . . . . . . . . . . . . . ....... ....... ....... ....... ....... ....... ....... ....... ...... ...... ...... ...... ...... ...... ...... ...... ....... ....... ....... ....... ....... ....... ....... ....... ...... ...... ...... ...... ...... ...... ...... ...... . . . . . . . . . . 21 . . . . . . . . . . 22 . . . . . . . . . . 23 . . . . . . . . . . 23 . . . . . . . . . . 23 . . . . . . . . . . 23 . . . . . . . . . . 24 . . . . . . . . . . 25
PROGRAMMING FLASH MEMORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Data Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Data Toggle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 ERASING FLASH MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Flash Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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Flash Erase Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Flash Erase Resume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 FLASH AND EEPROM MEMORY SPECIFIC FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Flash Memory and EEPROM Sector Protect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 MEMORY SELECT SIGNALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Memory Select Configuration for MCUs with Separate Program and Data Spaces . . . . . . . . 31 Separate Space Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Combined Space Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 PAGE REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 PLD'S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 The Turbo Bit in PSD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 DECODE PLD (DPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 COMPLEX PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Output Macrocell (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Product Term Allocator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 The OMC Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 The Output Enable of the OMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 MCU BUS INTERFACE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 PSD Interface to a Multiplexed 8-Bit Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 PSD Interface to a Non-Multiplexed 8-Bit Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Data Byte Enable Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 MCU Bus Interface Examples. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 80C31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 80C251 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 80C51XA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 68HC11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 General Port Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . MCU I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PLD I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Address Out Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Address In Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 . . . . 52 . . . . 54 . . . . 54 . . . . 54 . . . . 56
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Data Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Peripheral I/O Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 JTAG In-System Programming (ISP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Port Configuration Registers (PCR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Direction Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Drive Select Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Port Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Data In. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Data Out Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Output Macrocells (OMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Mask Macrocell Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Input Macrocells (IMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 Enable Out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Ports A and B - Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 Port C - Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Port D - Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 External Chip Select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 POWER MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Automatic Power-down (APD) Unit and Power-down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Power-down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 For Users of the HC11 (or compatible) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Other Power Saving Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 PLD Power Management. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 SRAM Standby Mode (Battery Backup). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Input Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Input Control Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 RESET TIMING AND DEVICE STATUS AT RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Power-On Reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 Warm Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 I/O Pin, Register and PLD Status at Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE . . . . . . . . . . . . . . . . . . . . . . 71 Standard JTAG Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 JTAG Extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Security, Flash memory and EEPROM Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 INITIAL DELIVERY STATE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 AC/DC PARAMETERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
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DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105 APPENDIX A.PQFP52 PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 APPENDIX B.PLCC52 PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 APPENDIX C.TQFP64 PIN ASSIGNMENTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108 REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
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SUMMARY DESCRIPTION
The PSD family of Programmable Microcontroller (MCU) Peripherals brings In-System Programmability (ISP) to Flash memory and programmable logic. The result is a simple and flexible solution for embedded designs. PSD devices combine many of the peripheral functions found in MCU based applications. PSD devices integrate an optimized "microcontroller macrocell" logic architecture. The Macrocell was created to address the unique requirements of embedded system designs. It allows direct connection between the system address/data bus and the internal PSD registers to simplify communication between the MCU and other supporting devices. The PSD family offers two methods to program PSD Flash memory while the PSD is soldered to a circuit board. In-System Programming (ISP) via JTAG An IEEE 1149.1 compliant JTAG interface is included on the PSD enabling the entire device (Flash memory, EEPROM, the PLD, and all configuration) to be rapidly programmed while soldered to the circuit board. This requires no MCU participation, which means the PSD can be programmed anytime, even while completely blank. The innovative JTAG interface to Flash memories is an industry first, solving key problems faced by designers and manufacturing houses, such as: First time programming. How do I get firmware into the Flash the very first time? JTAG is the answer, program the PSD while blank with no MCU involvement. Inventory build-up of pre-programmed devices. How do I maintain an accurate count of preprogrammed Flash memory and PLD devices based on customer demand? How many and what version? JTAG is the answer, build your hardware with blank PSDs soldered directly to the board and then custom program just before they are shipped to customer. No more labels on chips and no more wasted inventory. Expensive sockets. How do I eliminate the need for expensive and unreliable sockets? JTAG is the answer. Solder the PSD directly to the circuit board. Program first time and subsequent times with JTAG. No need to handle devices and bend the fragile leads. In-Application Programming (IAP) Two independent memory arrays (Flash and EEPROM) are included so the MCU can execute code from one memory while erasing and programming the other. Robust product firmware updates in the field are possible over any communication channel (CAN, Ethernet, UART, J1850, etc.) using this unique architecture. Designers are relieved of these problems: Simultaneous read and write to Flash memory. How can the MCU program the same memory from which it is executing code? It cannot. The PSD allows the MCU to operate the two memories concurrently, reading code from one while erasing and programming the other during IAP. Complex memory mapping. I have only a 64Kbyte address space to start with. How can I map these two memories efficiently? A Programmable Decode PLD is the answer. The concurrent PSD memories can be mapped anywhere in MCU address space, segment by segment with extremely high address resolution. As an option, the secondary Flash memory can be swapped out of the system memory map when IAP is complete. A built-in page register breaks the 64K-byte address limit. Separate program and data space. How can I write to Flash or EEPROM memory while it resides in "program" space during field firmware updates, my MCU won't allow it! The Flash PSD provides means to "reclassify" Flash or EEPROM memory as "data" space during IAP, then back to "program" space when complete. PSDsoft Express PSDsoft Express, a software development tool from ST, guides you through the design process step-by-step making it possible to complete an embedded MCU design capable of ISP/IAP in just hours. Select your MCU and PSDsoft Express takes you through the remainder of the design with point and click entry, covering PSD selection, pin definitions, programmable logic inputs and outputs, MCU memory map definition, ANSI-C code generation for your MCU, and merging your MCU firmware with the PSD design. When complete, two different device programmers are supported directly from PSDsoft Express: FlashLINK (JTAG) and PSDpro.
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Figure 2. PQFP52 Connections
40 CNTLO 41 RESET 43 CNTL1 42 CNTL2 46 GND 52 PB0 51 PB1 50 PB2 49 PB3 48 PB4 47 PB5 45 PB6 44 PB7
PD2 1 PD1 2 PD0 3 PC7 4 PC6 5 PC5 6 PC4 7 VCC 8 GND 9 PC3 10 PC2 11 PC1 12 PC0 13
39 AD15 38 AD14 37 AD13 36 AD12 35 AD11 34 AD10 33 AD9 32 AD8 31 VCC 30 AD7 29 AD6 28 AD5 27 AD4
PA7 14
PA6 15
PA5 16
PA4 17
PA3 18
GND 19
PA2 20
PA1 21
PA0 22
AD0 23
AD1 24
AD2 25
AD3 26
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Figure 3. PLCC52 Connections
CNTL2 RESET 48 CNTL1 CNTL0 47
PB0
PB1
PB2
PB3
PB4
PB5
GND
PB6 52
PB7 51
4
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
5
3
2
50
49
6
1
PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 PC1 PC0
46 45 44 43 42 41 40 39 38 37 36 35 34 22 23 24 25 26 27 28 29 31 32 30 33
AD15 AD14 AD13 AD12 AD11 AD10 AD9 AD8 VCC AD7 AD6 AD5 AD4
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
AD1
AD2
GND
AD0
AD3
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Figure 4. TQFP64 Connections
50 RESET 52 CNTL1 51 CNTL2 56 GND 55 GND 62 PB0 61 PB1 60 PB2 59 PB3 58 PB4 57 PB5 54 PB6 53 PB7 64 NC 63 NC 49 NC
PD2 1 PD1 2 PD0 3 PC7 4 PC6 5 PC5 6 VCC 7 VCC 8 VCC 9 GND 10 GND 11 PC3 12 PC2 13 PC1 14 PC0 15 NC 16
48 CNTL0 47 AD15 46 AD14 45 AD13 44 AD12 43 AD11 42 AD10 41 AD9 40 AD8 39 VCC 38 VCC 37 AD7 36 AD6 35 AD5 34 AD4 33 AD3
NC 17
NC 18
PA7 19
PA6 20
PA5 21
PA4 22
PA3 23
GND 24
GND 25
PA2 26
PA1 27
PA0 28
AD0 29
AD1 30
ND 31
AD2 32
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PSD813F1V
PIN DESCRIPTION
Table 1. Pin Description (for the PLCC52 package)
Pin Name Pin Type Description(1) This is the lower Address/Data port. Connect your MCU address or address/data bus according to the following rules: 1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect AD0-AD7 to this port. 2. If your MCU does not have a multiplexed address/data bus, or you are using an 80C251 in page mode, connect A0-A7 to this port. 3. If you are using an 80C51XA in burst mode, connect A4/D0 through A11/D7 to this port. ALE or AS latches the address. The PSD drives data out only if the READ signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs. This is the upper Address/Data port. Connect your MCU address or address/data bus according to the following rules: 1. If your MCU has a multiplexed address/data bus where the data is multiplexed with the lower address bits, connect A8-A15 to this port. 2. If your MCU does not have a multiplexed address/data bus, connect A8-A15 to this port. 3. If you are using an 80C251 in page mode, connect AD8-AD15 to this port. 4. If you are using an 80C51XA in burst mode, connect A12/D8 through A19/D15 to this port. ALE or AS latches the address. The PSD drives data out only if the READ signal is active and one of the PSD functional blocks was selected. The addresses on this port are passed to the PLDs. The following control signals can be connected to this port, based on your MCU: 1. WR - active Low Write Strobe input. 2. R_W - active High READ/active Low write input. This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. The following control signals can be connected to this port, based on your MCU: 1. RD - active Low Read Strobe input. 2. E - E clock input. 3. DS - active Low Data Strobe input. 4. PSEN - connect PSEN to this port when it is being used as an active Low READ signal. For example, when the 80C251 outputs more than 16 address bits, PSEN is actually the READ signal. This port is connected to the PLDs. Therefore, these signals can be used in decode and other logic equations. This port can be used to input the PSEN (Program Select Enable) signal from any MCU that uses this signal for code exclusively. If your MCU does not output a Program Select Enable signal, this port can be used as a generic input. This port is connected to the PLDs. Active Low Reset input. Resets I/O Ports, PLD macrocells and some of the Configuration Registers. Must be Low at Power-up.
ADIO0-7
30-37
I/O
ADIO8-15
39-46
I/O
CNTL0
47
I
CNTL1
50
I
CNTL2
49
I
Reset
48
I
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PSD813F1V
Pin Name Pin Type Description(1) These pins make up Port A. These port pins are configurable and can have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellAB0-7) outputs. 3. Inputs to the PLDs. 4. Latched address outputs (see Table 5). 5. Address inputs. For example, PA0-3 could be used for A0-A3 when using an 80C51XA in burst mode. 6. As the data bus inputs D0-D7 for non-multiplexed address/data bus MCUs. 7. D0/A16-D3/A19 in M37702M2 mode. 8. Peripheral I/O mode. Note: PA0-PA3 can only output CMOS signals with an option for high slew rate. However, PA4-PA7 can be configured as CMOS or Open Drain Outputs. These pins make up Port B. These port pins are configurable and can have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellAB0-7 or McellBC0-7) outputs. 3. Inputs to the PLDs. 4. Latched address outputs (see Table 5). Note: PB0-PB3 can only output CMOS signals with an option for high slew rate. However, PB4-PB7 can be configured as CMOS or Open Drain Outputs. PC0 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC0) output. 3. Input to the PLDs. 4. TMS Input2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC1 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC1) output. 3. Input to the PLDs. 4. TCK Input2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC2 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC2) output. 3. Input to the PLDs. 4. VSTBY - SRAM stand-by voltage input for SRAM battery backup. This pin can be configured as a CMOS or Open Drain output. PC3 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC3) output. 3. Input to the PLDs. 4. TSTAT output2 for the JTAG Serial Interface. 5. Ready/Busy output for In-System parallel programming. This pin can be configured as a CMOS or Open Drain output. PC4 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC4) output. 3. Input to the PLDs. 4. TERR output2 for the JTAG Interface. 5. Battery-on Indicator output (VBATON). Goes High when power is being drawn from an external battery. This pin can be configured as a CMOS or Open Drain output.
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
29 28 27 25 24 23 22 21
I/O
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
7 6 5 4 3 2 52 51
I/O
PC0
20
I/O
PC1
19
I/O
PC2
18
I/O
PC3
17
I/O
PC4
14
I/O
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PSD813F1V
Pin Name Pin Type Description(1) PC5 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC5) output. 3. Input to the PLDs. 4. TDI input2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC6 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC6) output. 3. Input to the PLDs. 4. TDO output2 for the JTAG Interface. This pin can be configured as a CMOS or Open Drain output. PC7 pin of Port C. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. CPLD macrocell (McellBC7) output. 3. Input to the PLDs. 4. DBE - active Low Data Byte Enable input from 68HC912 type MCUs. This pin can be configured as a CMOS or Open Drain output. PD0 pin of Port D. This port pin can be configured to have the following functions: 1. ALE/AS input latches address output from the MCU. 2. MCU I/O - write or read from a standard output or input port. 3. Input to the PLDs. 4. CPLD output (External Chip Select). PD1 pin of Port D. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. Input to the PLDs. 3. CPLD output (External Chip Select). 4. CLKIN - clock input to the CPLD macrocells, the APD Unit's Power-down counter, and the CPLD AND Array. PD2 pin of Port D. This port pin can be configured to have the following functions: 1. MCU I/O - write to or read from a standard output or input port. 2. Input to the PLDs. 3. CPLD output (External Chip Select). 4. PSD Chip Select Input (CSI). When Low, the MCU can access the PSD memory and I/ O. When High, the PSD memory blocks are disabled to conserve power. Supply Voltage Ground pins
PC5
13
I/O
PC6
12
I/O
PC7
11
I/O
PD0
10
I/O
PD1
9
I/O
PD2
8
I/O
VCC GND
15, 38 1, 16, 26
Note: 1. The pin numbers in this table are for the PLCC package only. See the Figure 2., page 7, for pin numbers on other package type. 2. These functions can be multiplexed with other functions.
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ADDRESS/DATA/CONTROL BUS
Figure 5. Block Diagram
PLD INPUT BUS PAGE REGISTER EMBEDDED ALGORITHM 8 SECTORS POWER MANGMT UNIT 1 MBIT MAIN FLASH MEMORY
CNTL0, CNTL1, CNTL2 SECTOR SELECTS FLASH DECODE PLD (DPLD) 4 SECTORS EEPROM - F1 SECTOR SELECTS SRAM SELECT PERIP I/O MODE SELECTS CSIOP ADIO PORT 73 FLASH ISP CPLD (CPLD) RUNTIME CONTROL AND I/O REGISTERS 3 EXT CS TO PORT D 16 OUTPUT MACROCELLS PORT A ,B & C 24 INPUT MACROCELLS CLKIN PORT A ,B & C 16 KBIT BATTERY BACKUP SRAM 73 PROG. MCU BUS INTRF. 256 KBIT SECONDARY MEMORY (BOOT OR DATA)
VSTDBY (PC2)
PROG. PORT PORT A
PA0 - PA7
AD0 - AD15
PROG. PORT PORT B
PB0 - PB7
PROG. PORT GLOBAL CONFIG. & SECURITY CLKIN MACROCELL FEEDBACK OR PORT INPUT PORT C
PC0 - PC7
PROG. PORT CLKIN PLD, CONFIGURATION & FLASH MEMORY LOADER JTAG SERIAL CHANNEL PORT D
PD0 - PD2
PSD813F1V
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PSD813F1V
PSD ARCHITECTURAL OVERVIEW
PSD devices contain several major functional blocks. Figure 5 shows the architecture of the PSD device. The functions of each block are described briefly in the following sections. Many of the blocks perform multiple functions and are user configurable. Memory The PSD contains the following memories: a 1 Mbit Flash memory a secondary 256 Kbit EEPROM memory a 16 Kbit SRAM Each of the memory blocks is briefly discussed in the following paragraphs. A more detailed discussion can be found in the section entitled MEMORY BLOCKS, page 18. The 1 Mbit Flash memory is the main memory of the PSD. It is divided into 8 equally-sized sectors that are individually selectable. The 256 Kbit EEPROM or Flash memory is divided into 4 equally-sized sectors. Each sector is individually selectable. The 16 Kbit SRAM is intended for use as a scratchpad memory or as an extension to the microcontroller SRAM. If an external battery is connected to the PSD's VSTBY pin, data will be retained in the event of a power failure. Each sector of memory can be located in a different address space as defined by the user. The access times for all memory types includes the address latching and DPLD decoding time. PLDs The device contains two PLD blocks, each optimized for a different function, as shown in Table 2. The functional partitioning of the PLDs reduces power consumption, optimizes cost/performance, and eases design entry. The Decode PLD (DPLD) is used to decode addresses and generate chip selects for the PSD internal memory and registers. The CPLD can implement user-defined logic functions. The DPLD has combinatorial outputs. The CPLD has 16 Output macrocells and 3 combinatorial outputs. The PSD also has 24 Input macrocells that can be configured as inputs to the PLDs. The PLDs receive their inputs from the PLD Input Bus and are differentiated by their output destinations, number of Product Terms, and macrocells. The PLDs consume minimal power by using ZeroPower design techniques. The speed and power consumption of the PLD is controlled by the Turbo Bit (ZPSD only) in the PMMR0 register and other bits in the PMMR2 registers. These registers are set by the microcontroller at runtime. There is a slight penalty to PLD propagation time when invoking the ZPSD features. I/O Ports The PSD has 27 I/O pins divided among four ports (Port A, B, C, and D). Each I/O pin can be individually configured for different functions. Ports A, B, C and D can be configured as standard MCU I/O ports, PLD I/O, or latched address outputs for microcontrollers using multiplexed address/data busses. The JTAG pins can be enabled on Port C for InSystem Programming (ISP). Ports A and B can also be configured as a data port for a n on-multiplexed bus or multiplexed Address/Data buses for certain types of 16-bit microcontrollers. Microcontroller Bus Interface The PSD easily interfaces with most 8-bit microcontrollers that have either multiplexed or nonmultiplexed address/data busses. The device is configured to respond to the microcontroller's control signals, which are also used as inputs to the PLDs. Where there is a requirement to use a 16bit data bus to interface to a 16-bit microcontroller, two PSDs must be used. For examples, please see the section entitled MCU Bus Interface Examples, page 47. Table 2. PLD I/O
Name Decode PLD (DPLD) Complex PLD (CPLD) Inputs 73 73 Outputs 17 19 Product Terms 42 140
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JTAG Port In-System Programming can be performed through the JTAG pins on Port C. This serial interface allows complete programming of the entire PSD device. A blank device can be completely programmed. The JTAG signals (TMS, TCK, TSTAT, TERR, TDI, TDO) can be multiplexed with other functions on Port C. Table 3 indicates the JTAG signals pin assignments. In-System Programming (ISP) Using the JTAG signals on Port C, the entire PSD device can be programmed or erased without the use of the microcontroller. The main Flash memory can also be programmed in-system by the microcontroller executing the programming algorithms out of the EEPROM or SRAM. The EEPROM can be programmed the same way by executing out of the main Flash memory. The PLD logic or other PSD configuration can be programmed through the JTAG port or a device programmer. Table 4 indicates which programming methods can program different functional blocks of the PSD. Page Register The 8-bit Page Register expands the address range of the microcontroller by up to 256 times. The paged address can be used as part of the address space to access external memory and peripherals, or internal memory and I/O. The Page Register can also be used to change the address mapping of blocks of Flash memory into different memory spaces for in-circuit programming. Power Management Unit (PMU) The Power Management Unit (PMU) in the PSD gives the user control of the power consumption on selected functional blocks based on system requirements. The PMU includes an Automatic Power Down unit (APD) that will turn off device functions due to microcontroller inactivity. The APD unit has a Power Down Mode that helps reduce power consumption. The PSD also has some bits that are configured at run-time by the MCU to reduce power consumption of the CPLD. The turbo bit in the PMMR0 register can be turned off and the CPLD will latch its outputs and go to sleep until the next transition on its inputs. Additionally, bits in the PMMR2 register can be set by the MCU to block signals from entering the CPLD to reduce power consumption. Please see the section entitled POWER MANAGEMENT, page 64 for more details. Table 3. JTAG SIgnals on Port C
Port C Pins PC0 PC1 PC3 PC4 PC5 PC6 TMS TCK TSTAT TERR TDI TDO JTAG Signal
Table 4. Methods of Programming Different Functional Blocks of the PSD
Functional Block Main Flash Memory EEPROM Memory PLD Array (DPLD and CPLD) PSD Configuration Optional OTP Row JTAG Programming Yes Yes Yes Yes No Device Programmer Yes Yes Yes Yes Yes In-System Parallel Programming Yes Yes No No Yes
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PSD813F1V
DEVELOPMENT SYSTEM
The PSD is supported by PSDsoft Express a Windows-based (95, 98, NT) software development tool. A PSD design is quickly and easily produced in a point and click environment. The designer does not need to enter Hardware Definition Language (HDL) equations (unless desired) to define PSD pin functions and memory map information. The general design flow is shown in Figure 6 below. PSDsoft Express is available from our web site (www.st.com/psm) or other distribution channels. Figure 6. PSDsoft Express Development Tool PSDsoft Express directly supports two low cost device programmers from ST, PSDpro and FlashLINK (JTAG). Both of these programmers may be purchased through your local distributor/ representative, or directly from our web site using a credit card. The PSD is also supported by third party device programmers, see web site for current list.
Choose MCU and PSD
Automatically configures MCU bus interface and other PSD attributes
Define PSD Pin and Node functions
Point and click definition of PSD pin functions, internal nodes, and MCU system memory map
C Code Generation
Generate C Code Specific to PSD Functions
Define General Purpose Logic in CPLD
Point and click definition of combinatorial and registered logic in CPLD. Access to HDL is available if needed MCU Firmware Hex or S-Record format User's choice of Microcontroller Compiler/Linker
Merge MCU Firmware with PSD Configuration
A composite object file is created containing MCU firmware and PSD configuration.
*.OBJ FILE
ST PSD Programmer
PSDPro, or FlashLINK (JTAG)
*.OBJ file available for 3rd party programmers (Conventional or JTAG-ISC)
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PSD REGISTER DESCRIPTION AND ADDRESS OFFSET
Table 5 shows the offset addresses to the PSD registers relative to the CSIOP base address. The CSIOP space is the 256 bytes of address that is allocated by the user to the internal PSD registers. Table 6 provides brief descriptions of the registers in CSIOP space. The following section gives a more detailed description.
Table 5. I/O Port Latched Address Output Assignments
MCU(1) 8051XA (8-bit) 80C251 (page mode) All other 8-bit multiplexed 8-bit non-multiplexed bus N/A N/A Address a3-a0 N/A Port A(2) Port A (3:0) N/A Address a7-a4 N/A Port A (7:4) Address a7-a4 Port B (3:0) Address a11-a8 Address a11-a8 Address a3-a0 Address a3-a0 N/A Address a15-a12 Address a7-a4 Address a7-a4 Port B(2) Port B (7:4)
Note: 1. See the section entitled I/O PORTS, page 52, on how to enable the Latched Address Output function. 2. N/A = Not Applicable
Table 6. Register Address Offset
Register Name Data In Control Data Out Direction Drive Select Input Macrocell Enable Out Output Macrocells AB Output Macrocells BC Mask Macrocells AB Mask Macrocells BC Primary Flash Protection Secondary Flash memory Protection JTAG Enable PMMR0 PMMR2 Page VM
Note: 1. Other registers that are not part of the I/O ports.
Port A 00 02 04 06 08 0A 0C 20
Port B 01 03 05 07 09 0B 0D 20 21
Port C 10
Port D 11
Other(1)
Description Reads Port pin as input, MCU I/O input mode Selects mode between MCU I/O or Address Out Stores data for output to Port pins, MCU I/O output mode Configures Port pin as input or output Configures Port pins as either CMOS or Open Drain on some pins, while selecting high slew rate on other pins. Reads Input Macrocells Reads the status of the output enable to the I/O Port driver READ - reads output of macrocells AB WRITE - loads macrocell flip-flops
12 14 16 18 1A
13 15 17
1B
21
READ - reads output of macrocells BC WRITE - loads macrocell flip-flops Blocks writing to the Output Macrocells AB
22
22 23 23 C0 C2 C7 B0 B4 E0 E2
Blocks writing to the Output Macrocells BC Read only - Flash Sector Protection Read only - PSD Security and EEPROM Sector Protection Enables JTAG Port Power Management Register 0 Power Management Register 2 Page Register Places PSD memory areas in Program and/or Data space on an individual basis.
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DETAILED OPERATION
As shown in Figure 5., page 13, the PSD consists of six major types of functional blocks: Memory Blocks PLD Blocks MCU Bus Interface I/O Ports Power Management Unit (PMU) JTAG Interface The functions of each block are described in the following sections. Many of the blocks perform multiple functions, and are user configurable. MEMORY BLOCKS The PSD has the following memory blocks (see Table 7): - The Main Flash memory - Secondary EEPROM memory - SRAM The Memory Select signals for these blocks originate from the Decode PLD (DPLD) and are userdefined in PSDsoft Express. Primary Flash Memory and Secondary EEPROM Description The 1Mb primary Flash memory is divided evenly into eight 16-KByte sectors. The EEPROM memory is divided into four sectors of eight KBytes each. Each sector of either memory can be separately protected from Program and Erase operations. Flash memory may be erased on a sector-by-sector basis and programmed byte-by-byte. Flash sector erasure may be suspended while data is read from other sectors of memory and then resumed after reading. EEPROM may be programmed byte-by-byte or sector-by-sector, and erasing is automatic and transparent. The integrity of the data can be secured with the help of Software Data Protection (SDP). Any write operation to the EEPROM is inhibited during the first five milliseconds following power-up. During a program or erase of Flash, or during a write of the EEPROM, the status can be output on the Ready/Busy (PC3) pin of Port C3. This pin is set up using PSDsoft Express Configuration. Memory Block Select Signals. The decode PLD in the PSD generates the chip selects for all the internal memory blocks (refer to the section entitled PLD'S, page 34). Each of the eight Flash memory sectors have a Flash Select signal (FS0FS7) which can contain up to three product terms. Each of the four EEPROM memory sectors have a Select signal (EES0-3 or CSBOOT0-3) which can contain up to three product terms. Having three product terms for each sector select signal allows a given sector to be mapped in different areas of system memory. When using a microcontroller with separate Program and Data space, these flexible select signals allow dynamic re-mapping of sectors from one space to the other. Ready/Busy Pin (PC3). Pin PC3 can be used to output the Ready/Busy status of the PSD. The output on the pin will be a `0' (Busy) when Flash or EEPROM memory blocks are being written to, or when the Flash memory block is being erased. The output will be a `1' (Ready) when no write or erase operation is in progress. Table 7. Memory Blocks
Device PSD813F1 Main Flash 128KB EEPROM 32KB SRAM 2KB
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Memory Operation The main Flash and EEPROM memory are addressed through the microcontroller interface on the PSD device. The microcontroller can access these memories in one of two ways: - The microcontroller can execute a typical bus WRITE or READ operation just as it would if accessing a RAM or ROM device using standard bus cycles. - The microcontroller can execute a specific instruction that consists of several WRITE and READ operations. This involves writing specific data patterns to special addresses within the Flash or EEPROM to invoke an embedded algorithm. These instructions are summarized in Table 8., page 20. Typically, Flash memory can be read by the microcontroller using READ operations, just as it would read a ROM device. However, Flash memory can only be erased and programmed with specific instructions. For example, the microcontroller cannot write a single byte directly to Flash memory as one would write a byte to RAM. To program a byte
into Flash memory, the microcontroller must execute a program instruction sequence, then test the status of the programming event. This status test is achieved by a READ operation or polling the Ready/Busy pin (PC3). The Flash memory can also be read by using special instructions to retrieve particular Flash device information (sector protect status and ID). The EEPROM is a bit different. Data can be written to EEPROM memory using write operations, like writing to a RAM device, but the status of each WRITE event must be checked by the microcontroller. A WRITE event can be one to 64 contiguous bytes. The status test is very similar to that used for Flash memory (READ operation or Ready/Busy). Optionally, the EEPROM memory may be put into a Software Data Protect (SDP) mode where it requires instructions, rather than operations, to alter its contents. SDP mode makes writing to EEPROM much like writing to Flash memory.
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Table 8. Instructions
Instruction EEPROM Flash Sector Sector Select Cycle 1 Cycle 2 Cycle 3 Select (FSi)(2) (EESi) Cycle 4 Read Identifier with (A6,A1,A0 at 0,0,1) Read byte Read 1 byte 2 Read identifier with (A6, A1; A0 = 0,1,0) Data@ address AAh@ X555h AAh@ X555h 55h@ XAAAh 55h@ XAAAh 30h@ 30h@ Sector Sector address address1 10h@ X555h Read byte N Cycle 5 Cycle 6 Cycle 7
Read Flash Identifier3,5 Read OTP row4 Read Sector Protection Status3,5 Program a Flash Byte5 Erase one Flash Sector5 Erase the Whole Flash5 Suspend Sector Erase5 Resume Sector Erase5 EEPROM Power Down4 SDP Enable/ EEPROM Write4 SDP Disable4 Write in OTP Row4,6 Return (from OTP Read or EEPROM Power-Down)4 Reset3.5 Reset (short instruction)5
0
1
AAh@ X555h
55h@ 90h@ XAAAh X555h
1
0
AAh@ X555h
55h@ 90h@ XAAAh X555h
0
1
AAh@ X555h
55h@ 90h@ XAAAh X555h
0
1
AAh@ X555h AAh@ X555h AAh@ X555h B0h@ XXXXh 30h@ XXXXh AAh@ X555h AAh@ X555h AAh@ X555h AAh@ X555h F0h@ XXXX AAh@ X555h F0h@ XXXX
55h@ A0h@ XAAAh X555h 55h@ 80h@ XAAAh X555h 55h@ 80h@ XAAAh X555h
0
1
0 0 0 1
1 1 1 0
55h@ 30h@ XAAAh X555h 55h@ A0h@ XAAAh X555h 55h@ 80h@ XAAAh X555h 55h@ B0h@ XAAAh X555h Write byte Write 1 byte 2 AAh@ X555h 55h@ XAAAh 20h@ X555h Write byte N Write byte N
1
0
1 1
0 0
Write byte Write 1 byte 2
1
0
0 0
1 1
55h@ F0h@ XAAAh XXXX
Note: 1. Additional sectors to be erased must be entered within 80 s. A Sector Address is any address within the Sector. 2. Flash and EEPROM Sector Selects are active high. Addresses A15-A12 are don't cares in Instruction Bus Cycles. 3. The Reset instruction is required to return to the normal READ mode if DQ5 goes high or after reading the Flash Identifier or Protection status. 4. The MCU cannot invoke these instructions while executing code from EEPROM. The MCU must be operating from some other memory when these instructions are performed. 5. The MCU cannot invoke these instructions while executing code from the same Flash memory for which the instruction is intended. The MCU must operate from some other memory when these instructions are executed. 6. Writing to OTP Row is allowed only when SDP mode is disabled.
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INSTRUCTIONS
An instruction is defined as a sequence of specific operations. Each received byte is sequentially decoded by the PSD and not executed as a standard write operation. The instruction is executed when the correct number of bytes are properly received and the time between two consecutive bytes is shorter than the time-out value. Some instructions are structured to include READ operations after the initial WRITE operations. The sequencing of any instruction must be followed exactly. Any invalid combination of instruction bytes or time-out between two consecutive bytes while addressing Flash memory will reset the device logic into READ mode (Flash memory reads like a ROM device). An invalid combination or time-out while addressing the EEPROM block will cause the offending byte to be interpreted as a single operation. The PSD supports these instructions (see Table 8., page 20): Flash memory: Erase memory by chip or sector Suspend or resume sector erase Program a Byte Reset to READ mode Read Flash Identifier value Read Sector Protection Status EEPROM: Write data to OTP Row Read data from OTP Row Power down memory Enable Software Data Protect (SDP) Disable SDP Return from read OTP Row read mode or power down mode. These instructions are detailed in Table 8., page 20. For efficient decoding of the instructions, the first two bytes of an instruction are the coded cycles and are followed by a command byte or confirmation byte. The coded cycles consist of writing the data AAh to address X555h during the first cycle and data 55h to address XAAAh during the second cycle. Address lines A15-A12 are don't cares during the instruction WRITE cycles. However, the appropriate sector select signal (FSi or EESi) must be selected. Power-down Instruction and Power-up Mode EEPROM Power Down Instruction. The EEPROM can enter power down mode with the help of the EEPROM power down instruction (see Table 8., page 20). Once the EEPROM power down instruction is decoded, the EEPROM memory cannot be accessed unless a Return instruction (also in Table 8., page 20) is decoded. Alternately, this power down mode will automatically occur when the APD circuit is triggered (see section entitled Automatic Power-down (APD) Unit and Powerdown Mode, page 65). Therefore, this instruction is not required if the APD circuit is used. Power-up Mode. The PSD internal logic is reset upon power-up to the READ mode. Any write operation to the EEPROM is inhibited during the first 5ms following power-up. The FSi and EESi select signals, along with the write strobe signal, must be in the false state during power-up for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of a write strobe signal. Any write cycle initiation is locked when VCC is below VLKO.
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READ Under typical conditions, the microcontroller may read the Flash or EEPROM memory using READ operations just as it would a ROM or RAM device. Alternately, the microcontroller may use READ operations to obtain status information about a Program or Erase operation in progress. Lastly, the microcontroller may use instructions to read special data from these memories. The following sections describe these READ functions. Read Memory Contents. Main Flash is placed in the READ mode after power-up, chip reset, or a Reset Flash instruction (see Table 8., page 20). The microcontroller can read the memory contents of main Flash or EEPROM by using READ operations any time the READ operation is not part of an instruction sequence. Read Main Flash Memory Identifier. The main Flash memory identifier is read with an instruction composed of 4 operations: 3 specific write operations and a READ operation (see Table 8). During the READ operation, address bits A6, A1, and A0 must be 0,0,1, respectively, and the appropriate sector select signal (FSi) must be active. The Flash ID is E3h for the PSD. The MCU can read the ID only when it is executing from the EEPROM. Read Main Flash Memory Sector Protection Status. The main Flash memory sector protection status is read with an instruction composed of 4 operations: 3 specific WRITE operations and a READ operation (see Table 8., page 20). During the READ operation, address bits A6, A1, and A0 must be 0,1,0, respectively, while the chip select FSi designates the Flash sector whose protection has to be verified. The READ operation will produce 01h if the Flash sector is protected, or 00h if the sector is not protected. The sector protection status for all NVM blocks (main Flash or EEPROM) can be read by the microcontroller accessing the Flash Protection and PSD/EE Protection registers in PSD I/O space. See Flash Memory and EEPROM Sector Protect, page 30 for register definitions. Table 9. Status Bit
Device Flash EEPROM FSi/ CSBOOTi VIH VIL EESi VIL VIH DQ7 Data Polling Data Polling DQ6 Toggle Flag Toggle Flag DQ5 Error Flag X DQ4 X X DQ3 Erase Timeout X DQ2 X X DQ1 X X DQ0 X X
Reading the OTP Row. There are 64 bytes of One-Time-Programmable (OTP) memory that reside in EEPROM. These 64 bytes are in addition to the 32 Kbytes of EEPROM memory. A READ of the OTP row is done with an instruction composed of at least 4 operations: 3 specific WRITE operations and one to 64 READ operations (see Table 8., page 20). During the READ operation(s), address bit A6 must be zero, while address bits A5A0 define the OTP Row byte to be read while any EEPROM sector select signal (EESi) is active. After reading the last byte, an EEPROM Return instruction must be executed (see Table 8., page 20). Reading the Erase/Program Status Bits. The PSD provides several status bits to be used by the microcontroller to confirm the completion of an erase or programming instruction of Flash memory. Bits are also available to show the status of WRITES to EEPROM. These status bits minimize the time that the microcontroller spends performing these tasks and are defined in Table 9. The status bits can be read as many times as needed. For Flash memory, the microcontroller can perform a READ operation to obtain these status bits while an Erase or Program instruction is being executed by the embedded algorithm. See the section entitled PROGRAMMING FLASH MEMORY, page 27 for details. For EEPROM not in SDP mode, the microcontroller can perform a READ operation to obtain these status bits just after a data WRITE operation. The microcontroller may write one to 64 bytes before reading the status bits. See the section entitled Writing to the EEPROM, page 24 for details. For EEPROM in SDP mode, the microcontroller will perform a READ operation to obtain these status bits while an SDP write instruction is being executed by the embedded algorithm. See section entitled EEPROM Software Data Protect (SDP), page 24 for details.
Note: 1. X = not guaranteed value, can be read either 1 or 0. 2. DQ7-DQ0 represent the Data Bus Bits, D7-D0. 3. FSi and EESi are active High.
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Data Polling Flag (DQ7) When Erasing or Programming the Flash memory (or when Writing into the EEPROM memory), bit DQ7 outputs the complement of the bit being entered for Programming/Writing on DQ7. Once the Program instruction or the WRITE operation is completed, the true logic value is read on DQ7 (in a Read operation). Flash memory specific features: - Data Polling is effective after the fourth WRITE pulse (for programming) or after the sixth WRITE pulse (for Erase). It must be performed at the address being programmed or at an address within the Flash sector being erased. - During an Erase instruction, DQ7 outputs a `0.' After completion of the instruction, DQ7 will output the last bit programmed (it is a `1' after erasing). - If the byte to be programmed is in a protected Flash sector, the instruction is ignored. - If all the Flash sectors to be erased are protected, DQ7 will be set to `0' for about 100s, and then return to the previous addressed byte. No erasure will be performed. Toggle Flag (DQ6) The PSD offers another way for determining when the EEPROM write or the Flash memory Program instruction is completed. During the internal WRITE operation and when either the FSi or EESi is true, the DQ6 will toggle from `0' to `1' and `1' to `0' on subsequent attempts to read any byte of the memory. When the internal cycle is complete, the toggling will stop and the data read on the Data Bus D0-7 is the addressed memory byte. The device is now accessible for a new READ or WRITE operation. The operation is finished when two successive reads yield the same output data. Flash memory specific features: The Toggle bit is effective after the fourth WRITE pulse (for programming) or after the sixth WRITE pulse (for Erase). If the byte to be programmed belongs to a protected Flash sector, the instruction is ignored. If all the Flash sectors selected for erasure are protected, DQ6 will toggle to `0' for about 100 s and then return to the previous addressed byte. Error Flag (DQ5) During a correct Program or Erase, the Error bit will set to `0.' This bit is set to `1' when there is a failure during Flash byte programming, Sector erase, or Bulk Erase. In the case of Flash programming, the Error Bit indicates the attempt to program a Flash bit(s) from the programmed state ('0') to the erased state ('1'), which is not a valid operation. The Error bit may also indicate a timeout condition while attempting to program a byte. In case of an error in Flash sector erase or byte program, the Flash sector in which the error occurred or to which the programmed byte belongs must no longer be used. Other Flash sectors may still be used. The Error bit resets after the Reset instruction. Erase Time-out Flag DQ3 (Flash Memory only) The Erase Timer bit reflects the time-out period allowed between two consecutive Sector Erase instructions. The Erase timer bit is set to `0' after a Sector Erase instruction for a time period of 100s + 20% unless an additional Sector Erase instruction is decoded. After this time period or when the additional Sector Erase instruction is decoded, DQ3 is set to `1.'
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Writing to the EEPROM Data may be written a byte at a time to the EEPROM using simple write operations, much like writing to an SRAM. Unlike SRAM though, the completion of each byte write must be checked before the next byte is written. To speed up this process, the PSD offers a Page write feature to allow writing of several bytes before checking status. To prevent inadvertent writes to EEPROM, the PSD offers a Software Data Protect (SDP) mode. Once enabled, SDP forces the MCU to "unlock" the EEPROM before altering its contents, much like Flash memory programming. Writing a Byte to EEPROM. A write operation is initiated when an EEPROM select signal (EESi) is true and the write strobe signal (WR) into the PSD is true. If the PSD detects no additional writes within 120sec, an internal storage operation is initiated. Internal storage to EEPROM memory technology typically takes a few milliseconds to complete. The status of the write operation is obtained by the MCU reading the Data Polling or Toggle bits (as detailed in section entitled READ, page 22), or the Ready/Busy output pin (section Ready/Busy Pin (PC3), page 18). Keep in mind that the MCU does not need to erase a location in EEPROM before writing it. Erasure is performed automatically as an internal process. Writing a Page to EEPROM. Writing data to EEPROM using page mode is more efficient than writing one byte at a time. The PSD EEPROM has a 64 byte volatile buffer that the MCU may fill before an internal EEPROM storage operation is initiated. Page mode timing approaches a 64:1 advantage over the time it takes to write individual bytes. To invoke page mode, the MCU must write to EEPROM locations within a single page, with no more than 120s between individual byte writes. A single page means that address lines A14 to A6 must remain constant. The MCU may write to the 64 locations on a page in any order, which is determined by address lines A5 to A0. As soon as 120s have expired after the last page write, the internal EEPROM storage process begins and the MCU checks programming status. Status is checked the same way it is for byte writes, described above. Note: Be aware that if the upper address bits (A14 to A6) change during page write operations, loss of data may occur. Ensure that all bytes for a given page have been successfully stored in the EEPROM before proceeding to the next page. Correct management of MCU interrupts during EEPROM page write operations is essential. EEPROM Software Data Protect (SDP). The SDP feature is useful for protecting the contents of EEPROM from inadvertent write cycles that may occur during uncontrolled MCU bus conditions. These may happen if the application software gets lost or when VCC is not within normal operating range. Instructions from the MCU are used to enable and disable SDP mode (see Table 8., page 20). Once enabled, the MCU must write an instruction sequence to EEPROM before writing data (much like writing to Flash memory). SDP mode can be used for both byte and page writes to EEPROM. The device will remain in SDP mode until the MCU issues a valid SDP disable instruction. PSD devices are shipped with SDP mode disabled. However, within PSDsoft Express, SDP mode may be enabled as part of programming the device with a device programmer (PSDpro). To enable SDP mode at run time, the MCU must write three specific data bytes at three specific memory locations, as shown in Figure 7., page 25. Any further writes to EEPROM when SDP is set will require this same sequence, followed by the byte(s) to write. The first SDP enable sequence can be followed directly by the byte(s) to be written. To disable SDP mode, the MCU must write specific bytes to six specific locations, as shown in Figure 8., page 26. The MCU must not be executing code from EEPROM when these instructions are invoked. The MCU must be operating from some other memory when enabling or disabling SDP mode. The state of SDP mode is not changed by power on/off sequences (nonvolatile). When either the SDP enable or SDP disable instructions are issued from the MCU, the MCU must use the Toggle bit (status bit DQ6) or the Ready/Busy output pin to check programming status. The Ready/Busy output is driven low from the first write of AAh @ 555h until the completion of the internal storage sequence. Data Polling (status bit DQ7) is not supported when issuing the SDP enable or SDP disable commands. Note: Using the SDP sequence (enabling, disabling, or writing data) is initiated when specific bytes are written to addresses on specific "pages" of EEPROM memory, with no more than 120s between WRITES. The addresses 555h and AAAh are located on different pages of EEPROM. This is how the PSD distinguishes these instruction sequences from ordinary writes to EEPROM, which are expected to be within a single EEPROM page.
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Writing the OTP Row Writing to the OTP row (64 bytes) can only be done once per byte, and is enabled by an instruction. This instruction is composed of three specific WRITE operations of data bytes at three specific memory locations followed by the data to be stored in the OTP row (refer to Table 8., page 20). Figure 7. EEPROM SDP Enable Flowcharts
SDP SDP Set not Set WRITE AAh to Address 555h
During the WRITE operations, address bit A6 must be zero, while address bits A5-A0 define the OTP Row byte to be written while any EEPROM Sector Select signal (EESi) is active. Writing the OTP Row is allowed only when SDP mode is not enabled.
WRITE AAh to Address 555h
Page Write Instruction
WRITE 55h to Address AAAh
WRITE 55h to Address AAAh Page Write Instruction WRITE A0h to Address 555h WRITE is enabled WRITE Data to be Written in any Address
WRITE A0h to Address 555h
SDP is set SDP ENABLE ALGORITHM
Write in Memory
Write Data + SDP Set after tWC (Write Cycle Time)
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Figure 8. Software Data Protection Disable Flowchart
WRITE AAh to Address 555h
WRITE 55h to Address AAAh
WRITE 80h to Address 555h Page Write Instruction WRITE AAh to Address 555h
WRITE 55h to Address AAAh
WRITE 20h to Address 555h
Unprotected State after tWC (Write Cycle time)
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PROGRAMMING FLASH MEMORY
Flash memory must be erased prior to being programmed. The MCU may erase Flash memory all at once or by-sector, but not byte-by-byte. A byte of Flash memory erases to all logic ones (FF hex), and its bits are programmed to logic zeros. Although erasing Flash memory occurs on a sector basis, programming Flash memory occurs on a byte basis. The PSD main Flash and optional boot Flash require the MCU to send an instruction to program a byte or perform an erase function (see Table 8., page 20). This differs from EEPROM, which can be programmed with simple MCU bus write operations (unless EEPROM SDP mode is enabled). Once the MCU issues a Flash memory program or erase instruction, it must check for the status of completion. The embedded algorithms that are invoked inside the PSD support several means to provide status to the MCU. Status may be checked using any of three methods: Data Polling, Data Toggle, or the Ready/Busy output pin. Data Polling Polling on DQ7 is a method of checking whether a Program or Erase instruction is in progress or has completed. Figure 9 shows the Data Polling algorithm. When the MCU issues a programming instruction, the embedded algorithm within the PSD begins. The MCU then reads the location of the byte to be programmed in Flash to check status. Data bit DQ7 of this location becomes the compliment of data bit 7of the original data byte to be programmed. The MCU continues to poll this location, comparing DQ7 and monitoring the Error bit on DQ5. When the DQ7 matches data bit 7 of the original data, and the Error bit at DQ5 remains `0', then the embedded algorithm is complete. If the Error bit at DQ5 is `1', the MCU should test DQ7 again since DQ7 may have changed simultaneously with DQ5 (see Figure 9). The Error bit at DQ5 will be set if either an internal timeout occurred while the embedded algorithm attempted to program the byte or if the MCU attempted to program a `1' to a bit that was not erased (not erased is logic `0'). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed to compare the byte that was written to Flash with the byte that was intended to be written. When using the Data Polling method after an erase instruction, Figure 9 still applies. However, DQ7 will be `0' until the erase operation is complete. A `1' on DQ5 will indicate a timeout failure of the erase operation, a `0' indicates no error. The MCU can read any location within the sector being erased to get DQ7 and DQ5. PSDsoft Express will generate ANSI C code functions which implement these Data Polling algorithms. Figure 9. Data Polling Flowchart
START
READ DQ5 & DQ7 at VALID ADDRESS
DQ7 = DATA NO NO
YES
DQ5 =1 YES READ DQ7
DQ7 = DATA NO FAIL
YES
PASS
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Data Toggle Checking the Data Toggle bit on DQ6 is a method of determining whether a Program or Erase instruction is in progress or has completed. Figure 10 shows the Data Toggle algorithm. When the MCU issues a programming instruction, the embedded algorithm within the PSD begins. The MCU then reads the location of the byte to be programmed in Flash to check status. Data bit DQ6 of this location will toggle each time the MCU reads this location until the embedded algorithm is complete. The MCU continues to read this location, checking DQ6 and monitoring the Error bit on DQ5. When DQ6 stops toggling (two consecutive reads yield the same value), and the Error bit on DQ5 remains `0', then the embedded algorithm is complete. If the Error bit on DQ5 is `1', the MCU should test DQ6 again, since DQ6 may have changed simultaneously with DQ5 (see Figure 10). The Error bit at DQ5 will be set if either an internal timeout occurred while the embedded algorithm attempted to program the byte, or if the MCU attempted to program a `1' to a bit that was not erased (not erased is logic `0'). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed to compare the byte that was written to Flash with the byte that was intended to be written. When using the Data Toggle method after an erase instruction, Figure 10 still applies. DQ6 will toggle until the erase operation is complete. A `1' on DQ5 will indicate a timeout failure of the erase operation, a `0' indicates no error. The MCU can read any location within the sector being erased to get DQ6 and DQ5.
PSDsoft Express will generate ANSI C code functions which implement these Data Toggling algorithms. Figure 10. Data Toggle Flowchart
START
READ DQ5 & DQ6
DQ6 = TOGGLE YES NO
NO
DQ5 =1 YES READ DQ6
DQ6 = TOGGLE YES FAIL
NO
PASS
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ERASING FLASH MEMORY
Flash Bulk Erase The Flash Bulk Erase instruction uses six write operations followed by a Read operation of the status register, as described in Table 8., page 20. If any byte of the Bulk Erase instruction is wrong, the Bulk Erase instruction aborts and the device is reset to the Read Flash memory status. During a Bulk Erase, the memory status may be checked by reading status bits DQ5, DQ6, and DQ7, as detailed in section entitled PROGRAMMING FLASH MEMORY, page 27. The Error bit (DQ5) returns a `1' if there has been an Erase Failure (maximum number of erase cycles have been executed). It is not necessary to program the array with 00h because the PSD will automatically do this before erasing to 0FFh. During execution of the Bulk Erase instruction, the Flash memory will not accept any instructions. Flash Sector Erase. The Sector Erase instruction uses six write operations, as described in Table 8., page 20. Additional Flash Sector Erase confirm commands and Flash sector addresses can be written subsequently to erase other Flash sectors in parallel, without further coded cycles, if the additional instruction is transmitted in a shorter time than the timeout period of about 100 s. The input of a new Sector Erase instruction will restart the time-out period. The status of the internal timer can be monitored through the level of DQ3 (Erase time-out bit). If DQ3 is `0', the Sector Erase instruction has been received and the timeout is counting. If DQ3 is `1', the timeout has expired and the PSD is busy erasing the Flash sector(s). Before and during Erase timeout, any instruction other than Erase suspend and Erase Resume will abort the instruction and reset the device to READ mode. It is not necessary to program the Flash sector with 00h as the PSD will do this automatically before erasing (byte=FFh). During a Sector Erase, the memory status may be checked by reading status bits DQ5, DQ6, and DQ7, as detailed in section entitled PROGRAMMING FLASH MEMORY, page 27. During execution of the erase instruction, the Flash block logic accepts only Reset and Erase Suspend instructions. Erasure of one Flash sector may be suspended, in order to read data from another Flash sector, and then resumed. Flash Erase Suspend When a Flash Sector Erase operation is in progress, the Erase Suspend instruction will suspend the operation by writing 0B0h to any address when an appropriate Chip Select (FSi) is true. (See Table 8., page 20). This allows reading of data from another Flash sector after the Erase operation has been suspended. Erase suspend is accepted only during the Flash Sector Erase instruction execution and defaults to READ mode. An Erase Suspend instruction executed during an Erase timeout will, in addition to suspending the erase, terminate the time out. The Toggle Bit DQ6 stops toggling when the PSD internal logic is suspended. The toggle Bit status must be monitored at an address within the Flash sector being erased. The Toggle Bit will stop toggling between 0.1 s and 15 s after the Erase Suspend instruction has been executed. The PSD will then automatically be set to Read Flash Block Memory Array mode. If an Erase Suspend instruction was executed, the following rules apply: Attempting to read from a Flash sector that was being erased will output invalid data. Reading from a Flash sector that was not being erased is valid. The Flash memory cannot be programmed, and will only respond to Erase Resume and Reset instructions (READ is an operation and is OK). If a Reset instruction is received, data in the Flash sector that was being erased will be invalid. Flash Erase Resume If an Erase Suspend instruction was previously executed, the erase operation may be resumed by this instruction. The Erase Resume instruction consists of writing 030h to any address while an appropriate Chip Select (FSi) is true. (See Table 8., page 20.)
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FLASH AND EEPROM MEMORY SPECIFIC FEATURES
Flash Memory and EEPROM Sector Protect Each Flash and EEPROM sector can be separately protected against Program and Erase functions. Sector Protection provides additional data security because it disables all program or erase operations. This mode can be activated through the JTAG Port or a Device Programmer. Sector protection can be selected for each sector using the PSDsoft Configuration program. This will automatically protect selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash and EEPROM sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The microcontroller can read (but cannot change) the sector protection bits. Any attempt to program or erase a protected Flash or EEPROM sector will be ignored by the device. The Verify operation will result in a READ of the protected data. This allows a guarantee of the retention of the Protection status. The sector protection status can be read by the MCU through the Flash protection and PSD/EE protection registers (CSIOP). See Table 10. Reset The Reset instruction resets the internal memory logic state machine in a few milliseconds. Reset is an instruction of either one write operation or three write operations (refer to Table 8., page 20).
Table 10. Sector Protection/Security Bit Definition - Flash Protection Register
Bit 7 Sec7_Prot Bit 6 Sec6_Prot Bit 5 Sec5_Prot Bit 4 Sec4_Prot Bit 3 Sec3_Prot Bit 2 Sec2_Prot Bit 1 Sec1_Prot Bit 0 Sec0_Prot
Note: 1. Bit Definitions: Sec_Prot 1 = Flash is write protected. Sec_Prot 0 = Flash is not write protected.
Table 11. Sector Protection/Security Bit Definition - PSD/EE Protection Register
Bit 7 Security_Bit Bit 6 not used Bit 5 not used Bit 4 not used Bit 3 Sec3_Prot Bit 2 Sec2_Prot Bit 1 Sec1_Prot Bit 0 Sec0_Prot
Note: 1. Bit Definitions: Sec_Prot 1 = EEPROM Boot Sector is write protected. Sec_Prot 0 = EEPROM Boot Sector is not write protected. Security_Bit 0 = Security Bit in device has not been set. 1 = Security Bit in device has been set.
SRAM
The SRAM is a 16 Kbit (2K x 8) memory. The SRAM is enabled when RS0--the SRAM chip select output from the DPLD--is high. RS0 can contain up to two product terms, allowing flexible memory mapping. The SRAM can be backed up using an external battery. The external battery should be connected to the VSTBY pin (PC2). If you have an external battery connected to the PSD, the contents of the SRAM will be retained in the event of a power loss. The contents of the SRAM will be retained so long as the battery voltage remains at 2V or greater. If the supply voltage falls below the battery voltage, an internal power switchover to the battery occurs. Pin PC4 can be configured as an output that indicates when power is being drawn from the external battery. This VBATON signal will be high with the supply voltage falls below the battery voltage and the battery on PC2 is supplying power to the internal SRAM. The chip select signal (RS0) for the SRAM, VSTBY, and VBATON are all configured using PSDsoft Express Configuration.
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MEMORY SELECT SIGNALS
The main Flash (FSi), EEPROM (EESi), and SRAM (RS0) memory select signals are all outputs of the DPLD. They are setup by entering equations for them in PSDsoft Express. The following rules apply to the equations for the internal chip select signals: 1. Flash memory and EEPROM sector select signals must not be larger than the physical sector size. 2. Any main Flash memory sector must not be mapped in the same memory space as another Flash sector. 3. An EEPROM sector must not be mapped in the same memory space as another EEPROM sector. 4. SRAM, I/O, and Peripheral I/O spaces must not overlap. 5. An EEPROM sector may overlap a main Flash memory sector. In case of overlap, priority will be given to the EEPROM. 6. SRAM, I/O, and Peripheral I/O spaces may overlap any other memory sector. Priority will be given to the SRAM, I/O, or Peripheral I/O. Example FS0 is valid when the address is in the range of 8000h to BFFFh, EES0 is valid from 8000h to 9FFFh, and RS0 is valid from 8000h to 87FFh. Any address in the range of RS0 will always access the SRAM. Any address in the range of EES0 greater than 87FFh (and less than 9FFFh) will automatically address EEPROM segment 0. Any address greater than 9FFFh will access the Flash memory segment 0. You can see that half of the Flash memory segment 0 and one-fourth of EEPROM segment 0 can not be accessed in this example. Also note that an equation that defined FS1 to anywhere in the range of 8000h to BFFFh would not be valid. Figure 11 shows the priority levels for all memory components. Any component on a higher level can overlap and has priority over any component on a lower level. Table 12. VM Register
Bit 7 PIO_EN Bit 6 Bit 5 Bit 4 FL_Data 0 = RD can't access Flash memory 1 = RD access Flash memory Bit 3 EE_Data Bit 2 FL_Code Bit 1 EE_Code Bit 0 SRAM_Code
Components on the same level must not overlap. Level one has the highest priority and level 3 has the lowest. Memory Select Configuration for MCUs with Separate Program and Data Spaces The 8031 and compatible family of microcontrollers, which includes the 80C51, 80C151, 80C251, 80C51XA, and the C500 family, have separate address spaces for code memory (selected using PSEN) and data memory (selected using RD). Any of the memories within the PSD can reside in either space or both spaces. This is controlled through manipulation of the VM register that resides in the PSD's CSIOP space. The VM register is set using PSDsoft Express to have an initial value. It can subsequently be changed by the microcontroller so that memory mapping can be changed on-the-fly. For example, I may wish to have SRAM and Flash in Data Space at boot, and EEPROM in Program Space at boot, and later swap EEPROM and Flash. This is easily done with the VM register by using PSDsoft Express to configure it for boot up and having the microcontroller change it when desired. Table 12 describes the VM Register. Figure 11. Priority Level of Memory and I/O Components
Highest Priority
Level 1 SRAM, I /O, or Peripheral I /O Level 2 Secondary EEPROM Memory Level 3 Flash Memory Lowest Priority
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0 = disable not used PIO mode
not used
0 = PSEN 0 = RD can't can't access access EEPROM Flash memory 1 = RD access EEPROM 1 = PSEN access Flash memory
0 = PSEN 0 = PSEN can't can't access access EEPROM SRAM 1 = PSEN 1 = PSEN access access EEPROM SRAM
1= enable PIO mode
not used
not used
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Separate Space Modes Code memory space is separated from data memory space. For example, the PSEN signal is used to access the program code from the Flash Memory, while the RD signal is used to access data from the EEPROM, SRAM and I/O Ports. This configuration requires the VM register to be set to 0Ch. See Figure 12. Figure 12. 80C31 Memory Modes - Separate Space Combined Space Modes The program and data memory spaces are combined into one space that allows the main Flash Memory, EEPROM, and SRAM to be accessed by either PSEN or RD. For example, to configure the main Flash memory in combined space mode, bits 2 and 4 of the VM register are set to "1" (see Figure 13).
DPLD
RS0 EES0-EES3 FS0-FS7
Flash Memory
EEPROM Memory
SRAM
CS OE
CS OE
CS OE
PSEN RD
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Figure 13. 80C31 Memory Mode - Combined Space
DPLD
RS0 EES0-EES3 FS0-FS7
Flash Memory
EEPROM Memory
SRAM
RD
CS OE
CS OE
CS OE
VM REG BIT 3
VM REG BIT 4
PSEN
VM REG BIT 1
VM REG BIT 2
RD
VM REG BIT 0
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PAGE REGISTER
The 8-bit Page Register increases the addressing capability of the microcontroller by a factor of up to 256. The contents of the register can also be read by the microcontroller. The outputs of the Page Register (PGR0-PGR7) are inputs to the DPLD decoder and can be included in the Flash Memory, EEPROM, and SRAM chip select equations. If memory paging is not needed, or if not all 8 page register bits are needed for memory paging, then these bits may be used in the CPLD for general logic. Figure 14. Page Register
RESET
Figure 14 shows the Page Register. The eight flip flops in the register are connected to the internal data bus D0-D7. The microcontroller can write to or read from the Page Register. The Page Register can be accessed at address location CSIOP + E0h.
D0 D1 D0 - D7 D2 D3 D4 D5 D6 R/W D7
Q0 Q1 Q2 Q3 Q4 Q5
PGR0 PGR1 PGR2 PGR3 PGR4 PGR5 PGR6 Flash DPLD AND Flash CPLD
INTERNAL SELECTS AND LOGIC
Q6 PGR7 Q7
PAGE REGISTER
PLD
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PLD'S
The PLDs bring programmable logic functionality to the PSD. After specifying the logic for the PLDs using the PSDabel tool in PSDsoft Express, the logic is programmed into the device and available upon power-up. The PSD contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD). The PLDs are briefly discussed in the next few paragraphs, and in more detail in the sections entitled DECODE PLD (DPLD) and COMPLEX PLD (CPLD). Figure 15., page 35 shows the configuration of the PLDs. The DPLD performs address decoding for internal and external components, such as memory, registers, and I/O port selects. The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the 16 Output macrocells (OMCs), 24 Input macrocells (IMCs), and the AND array. The CPLD can also be used to generate external chip selects. The AND array is used to form product terms. These product terms are specified using PSDabel. An Input Bus consisting of 73 signals is connected to the PLDs. The signals are shown in Table 13. The Turbo Bit in PSD The PLDs in the PSD can minimize power consumption by switching off when inputs remain unchanged for an extended time of about 70ns. Setting the Turbo mode bit to off (Bit 3 of the PMMR0 register) automatically places the PLDs into standby if no inputs are changing. Turbo-off mode increases propagation delays while reducing power consumption. See the section entitled POWER MANAGEMENT, page 64, on how to set the Turbo Bit. Additionally, five bits are available in the PMMR2 register to block MCU control signals from entering the PLDs. This reduces power consumption and can be used only when these MCU control signals are not used in PLD logic equations. The PLDs in the PSD can minimize power consumption by switching off when inputs remain unchanged for an extended time of about 70ns. Each of the two PLDs has unique characteristics suited for its applications. They are described in the following sections. Table 13. DPLD and CPLD Inputs
Input Source MCU Address Bus1 MCU Control Signals Reset Power-down Port A Input Macrocells Port B Input Macrocells Port C Input Macrocells Port D Inputs Page Register Macrocell AB Feedback Macrocell BC Feedback EEPROM Program Status Bit Input Name A15-A0 CNTL2-CNTL0 RST PDN PA7-PA0 PB7-PB0 PC7-PC0 PD2-PD0 PGR7-PGR0 MCELLAB.FB7FB0 MCELLBC.FB7FB0 Ready/Busy Number of Signals 16 3 1 1 8 8 8 3 8 8 8 1
Note: 1. The address inputs are A19-A4 in 80C51XA mode.
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8
Figure 15. PLD Diagram
DATA BUS
PAGE REGISTER
DECODE PLD
FLASH MEMORY SELECTS EEPROM SELECTS SRAM SELECT CSIOP SELECT PERIPHERAL SELECTS JTAG SELECT 73 4 1 1 2 1
8
PLD INPUT BUS
16
OUTPUT MACROCELL FEEDBACK
DIRECT MACROCELL ACCESS FROM MCU DATA BUS
CPLD
16 OUTPUT MACROCELL PT ALLOC. 73
MACROCELL ALLOC.
MCELLAB TO PORT A OR B MCELLBC TO PORT B OR C I/O PORTS
8
24 INPUT MACROCELL (PORT A,B,C)
8 3 EXTERNAL CHIP SELECTS TO PORT D
DIRECT MACROCELL INPUT TO MCU DATA BUS 24 INPUT MACROCELL & INPUT PORTS
3
PORT D INPUTS
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DECODE PLD (DPLD)
The DPLD, shown in Figure 16, is used for decoding the address for internal and external components. The DPLD can be used to generate the following decode signals: 8 sector selects for the main Flash memory (three product terms each) 4 sector selects for the EEPROM (three product terms each) Figure 16. DPLD Logic Array
3 3 3 3 (INPUTS) I /O PORTS (PORT A,B,C) MCELLAB.FB [7:0] (FEEDBACKS) MCELLBC.FB [7:0] (FEEDBACKS) PGR0 - PGR7 A[15:0](1) PD[2:0] (ALE,CLKIN,CSI) PDN (APD OUTPUT) (24) 3 (8) 3 (8) 3 (8) 3 (16) 3 (3) 3 (1) 3 CNTRL[2:0] (READ/WRITE CONTROL SIGNALS) (3) RESET RD_BSY (1) 2 (1) 1 1 1 1 CSIOP PSEL0 PSEL1 JTAGSEL PERIPHERAL I/O MODE SELECT RS0 SRAM SELECT I/O DECODER SELECT 3 EES 0 EES 1 EES 2 EES 3 EEPROM SELECTS

1 internal SRAM select signal (two product terms) 1 internal CSIOP (PSD configuration register) select signal 1 JTAG select signal (enables JTAG on Port C) 2 internal peripheral select signals (peripheral I/O mode).
FS0 FS1 FS2 FS3 FS4 FS5 FS6 FS7 8 FLASH MEMORY SECTOR SELECTS
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Note: 1. The address inputs are A19-A4 in 80C51XA mode.
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COMPLEX PLD (CPLD)
The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols, state machines, and random logic. The CPLD can also be used to generate 3 external chip selects, routed to Port D. Although external chip selects can be produced by any Output Macrocell, these three external chip selects on Port D do not consume any Output macrocells. As shown in Figure 15., page 35, the CPLD has the following blocks: 24 Input macrocells (IMCs) 16 Output macrocells (OMCs) Macrocell Allocator Product Term Allocator Figure 17. Macrocell and I/O Port
PLD INPUT BUS PRODUCT TERMS FROM OTHER MACROCELLS MCU ADDRESS / DATA BUS TO OTHER I/O PORTS
AND array capable of generating up to 137 product terms Four I/O ports. Each of the blocks are described in the subsections that follow. The Input Macrocells (IMC) and Output Macrocells (OMC) are connected to the PSD internal data bus and can be directly accessed by the microcontroller. This enables the MCU software to load data into the Output Macrocells (OMC) or read data from both the Input and Output Macrocells (IMC and OMC). This feature allows efficient implementation of system logic and eliminates the need to connect the data bus to the AND logic array as required in most standard PLD macrocell architectures.
CPLD MACROCELLS
PT PRESET PRODUCT TERM ALLOCATOR MCU DATA IN MCU LOAD DATA LOAD CONTROL
I/O PORTS
LATCHED ADDRESS OUT DATA WR
I/O PIN
D Q MUX
AND ARRAY
UP TO 10 PRODUCT TERMS MACROCELL OUT TO MCU CPLD OUTPUT
PR DI LD PT CLOCK D/T MUX Q COMB. /REG SELECT CPLD OUTPUT MACROCELL TO I/O PORT ALLOC. WR PT CLEAR PDR INPUT SELECT
PLD INPUT BUS
GLOBAL CLOCK CLOCK SELECT
D/T/JK FF SELECT CK CL
MUX
POLARITY SELECT
D
Q DIR REG.
PT OUTPUT ENABLE (OE) MACROCELL FEEDBACK I/O PORT INPUT
INPUT MACROCELLS
MUX QD
PT INPUT LATCH GATE/CLOCK MUX ALE/AS
QD G
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Output Macrocell (OMC) Eight of the Output Macrocells (OMC) are connected to Ports A and B pins and are named as McellAB0-McellAB7. The other eight macrocells are connected to Ports B and C pins and are named as McellBC0-McellBC7. If an McellAB output is not assigned to a specific pin in PSDabel, the Macrocell Allocator will assign it to either Port A or B. The same is true for a McellBC output on Port B or C. Table 14 shows the macrocells and Port assignment. The Output Macrocell (OMC) architecture is shown in Figure 18., page 40. As shown in the figure, there are native product terms available from the AND array, and borrowed product terms available (if unused) from other OMCs. The polarity of the product term is controlled by the XOR gate.
The OMC can implement either sequential logic, using the flip-flop element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer output can drive a Port pin and has a feedback path to the AND array inputs. The flip-flop in the OMC can be configured as a D, T, JK, or SR type in the PSDabel program. The flip-flop's clock, preset, and clear inputs may be driven from a product term of the AND array. Alternatively, the external CLKIN signal can be used for the clock input to the flip-flop. The flip-flop is clocked on the rising edge of the clock input. The preset and clear are active-high inputs. Each clear input can use up to two product terms.
Table 14. Output Macrocell Port and Data Bit Assignments
Output Macrocell McellAB0 McellAB1 McellAB2 McellAB3 McellAB4 McellAB5 McellAB6 McellAB7 McellBC0 McellBC1 McellBC2 McellBC3 McellBC4 McellBC5 McellBC6 McellBC7 Port Assignment Port A0, B0 Port A1, B1 Port A2, B2 Port A3, B3 Port A4, B4 Port A5, B5 Port A6, B6 Port A7, B7 Port B0, C0 Port B1, C1 Port B2, C2 Port B3, C3 Port B4, C4 Port B5, C5 Port B6, C6 Port B7, C7 Native Product Terms 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 Maximum Borrowed Product Terms 6 6 6 6 6 6 6 6 5 5 5 5 6 6 6 6 Data Bit for Loading or Reading D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7
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Product Term Allocator The CPLD has a Product Term Allocator. The PSDabel compiler uses the Product Term Allocator to borrow and place product terms from one macrocell to another. The following list summarizes how product terms are allocated: McellAB0-McellAB7 all have three native product terms and may borrow up to six more McellBC0-McellBC3 all have four native product terms and may borrow up to five more McellBC4-McellBC7 all have four native product terms and may borrow up to six more. Each macrocell may only borrow product terms from certain other macrocells. Product terms already in use by one macrocell are not available for another macrocell. If an equation requires more product terms than are available to it, then "external" product terms are required, which will consume other Output Macrocells (OMC). If external product terms are used, extra delay will be added for the equation that required the extra product terms. This is called product term expansion. PSDsoft Express will perform this expansion as needed. Loading and Reading the Output Macrocells (OMC). The OMCs occupy a memory location in the MCU address space, as defined by the CSIOP (refer to the I/O section). The flip-flops in each of the 16 OMCs can be loaded from the data bus by a microcontroller. Loading the OMCs with data from the MCU takes priority over internal functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the MCU. The ability to load the flip-flops and read them back is useful in such applications as loadable counters
and shift registers, mailboxes, and handshaking protocols. Data can be loaded to the OMCs on the trailing edge of the WR signal (edge loading) or during the time that the WR signal is active (level loading). The method of loading is specified in PSDsoft Express Configuration. The OMC Mask Register There is one Mask Register for each of the two groups of eight OMCs. The Mask Registers can be used to block the loading of data to individual OMCs. The default value for the Mask Registers is 00h, which allows loading of the OMCs. When a given bit in a Mask Register is set to a `1', the MCU will be blocked from writing to the associated OMC. For example, suppose McellAB0-3 are being used for a state machine. You would not want a MCU write to McellAB to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellAB (Mask Macrocell AB) with the value 0Fh. The Output Enable of the OMC The OMC can be connected to an I/O port pin as a PLD output. The output enable of each Port pin driver is controlled by a single product term from the AND array, ORed with the Direction Register output. The pin is enabled upon power up if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft Express. If the OMC output is declared as an internal node and not as a Port pin output in the PSDabel file, then the Port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND array.
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AND ARRAY
PLD INPUT BUS
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MASK REG. MACROCELL CS INTERNAL DATA BUS D [ 7:0] RD PT ALLOCATOR DIRECTION REGISTER ENABLE (.OE) PRESET(.PR) PT PT DIN PR MUX PT POLARITY SELECT IN CLR PROGRAMMABLE FF (D/T/JK /SR) MUX PORT DRIVER CLEAR (.RE) PT CLK CLKIN LD Q MACROCELL ALLOCATOR I/O PIN COMB/REG SELECT WR FEEDBACK (.FB) PORT INPUT INPUT MACROCELL
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Figure 18. CPLD Output Macrocell
PSD813F1V
Input Macrocells (IMC) The CPLD has 24 IMCs, one for each pin on Ports A, B, and C. The architecture of the IMC is shown in Figure 19., page 42. The IMCs are individually configurable, and can be used as a latch, register, or to pass incoming Port signals prior to driving them onto the PLD input bus. The outputs of the IMCs can be read by the microcontroller through the internal data bus. The enable for the latch and clock for the register are driven by a multiplexer whose inputs are a product term from the CPLD AND array or the MCU address strobe (ALE/AS). Each product term output is used to latch or clock four IMCs. Port inputs 3-0 can be controlled by one product term and 7-4 by another. Configurations for the IMCs are specified by equations written in PSDabel (see Application Note 55). Outputs of the IMCs can be read by the MCU via
the IMC buffer. See the I/O Port section on how to read the IMCs. IMCs can use the address strobe to latch address bits higher than A15. Any latched addresses are routed to the PLDs as inputs. IMCs are particularly useful with handshaking communication applications where two processors pass data back and forth through a common mailbox. Figure 20., page 43 shows a typical configuration where the Master MCU writes to the Port A Data Out Register. This, in turn, can be read by the Slave MCU via the activation of the "SlaveRead" output enable product term. The Slave can also write to the Port A IMCs and the Master can then read the IMCs directly. Note that the "Slave-Read" and "Slave-wr" signals are product terms that are derived from the Slave MCU inputs RD, WR, and Slave_CS.
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AND ARRAY
PLD INPUT BUS
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INTERNAL DATA BUS D [ 7:0] INPUT MACROCELL _ RD DIRECTION REGISTER ENABLE ( .OE ) PT OUTPUT MACROCELLS BC AND MACROCELL AB I/O PIN PT PORT DRIVER MUX Q D MUX D FF FEEDBACK Q D G LATCH INPUT MACROCELL
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Figure 19. Input Macrocell
PT ALE/AS
PSD
SLAVE- CS RD WR SLAVE-READ PORT A DATA OUT REGISTER MCU- RD D MCU-WR Q MASTER MCU SLAVE-WR D [ 7:0] PORT A INPUT MACROCELL Q MCU-RD D MCU- WR CPLD D [ 7:0] PORT A
Figure 20. Handshaking Communication Using Input Macrocells
SLAVE MCU
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MCU BUS INTERFACE
The "no-glue logic" PSD MCU Bus Interface block can be directly connected to most popular MCUs and their control signals. Key 8-bit MCUs, with their bus types and control signals, are shown in Table 15. The interface type is specified using the PSDsoft Express Configuration.
Table 15. MCUs and their Control Signals
MCU 8031 80C51XA 80C251 80C251 80198 68HC11 68HC912 Z80 Z8 68330 M37702M2 Data Bus Width 8 8 8 8 8 8 8 8 8 8 8 CNTL0 WR WR WR WR WR R/W R/W WR R/W R/W R/W CNTL1 RD RD PSEN RD RD E E RD DS DS E CNTL2 PSEN PSEN PC7 PD02 ADIO0 A0 A4 A0 A0 A0 A0 A0 PA3-PA0 (Note 1) A3-A0 (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) D3-D0 (Note 1) (Note 1) D3-D0 PA7-PA3 (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) D7-D4 (Note 1) (Note 1) D7-D4
(Note 1) ALE (Note 1) ALE
(Note 1) (Note 1) ALE PSEN (Note 1) ALE
(Note 1) (Note 1) ALE (Note 1) (Note 1) AS (Note 1) DBE AS
(Note 1) (Note 1) (Note 1) A0 (Note 1) (Note 1) AS (Note 1) (Note 1) AS (Note 1) (Note 1) ALE A0 A0 A0
Note: 1. Unused CNTL2 pin can be configured as CPLD input. Other unused pins (PC7, PD0, PA3-0) can be configured for other I/O functions. 2. ALE/AS input is optional for MCUs with a non-multiplexed bus
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PSD Interface to a Multiplexed 8-Bit Bus Figure 21 shows an example of a system using a MCU with an 8-bit multiplexed bus and a PSD. The ADIO port on the PSD is connected directly to the MCU address/data bus. Address Strobe (ALE/AS, PD0) latches the address signals internally. Latched addresses can be brought out to Port A or
B. The PSD drives the ADIO data bus only when one of its internal resources is accessed and Read Strobe (RD, CNTL1) is active. Should the system address bus exceed sixteen bits, Ports A, B, C, or D may be used as additional address inputs.
Figure 21. An Example of a Typical 8-bit Multiplexed Bus Interface
MCU
AD [ 7:0]
PSD
PORT A A [ 7: 0] (OPTIONAL)
A[ 15:8]
ADIO PORT
PORT B WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST ALE ALE (PD0) PORT D RESET
A [ 15: 8] (OPTIONAL)
PORT C
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PSD Interface to a Non-Multiplexed 8-Bit Bus Figure 22 shows an example of a system using a microcontroller with an 8-bit non-multiplexed bus and a PSD. The address bus is connected to the ADIO Port, and the data bus is connected to Port
A. Port A is in tri-state mode when the PSD is not accessed by the microcontroller. Should the system address bus exceed sixteen bits, Ports B, C, or D may be used for additional address inputs.
Figure 22. An Example of a Typical 8-bit Non-Multiplexed Bus Interface
MCU
D [ 7:0]
PSD
PORT A D [ 7:0]
ADIO PORT A [ 15:0]
PORT B WR RD BHE WR (CNTRL0) RD (CNTRL1) BHE (CNTRL2) RST
A[ 23:16] (OPTIONAL)
PORT C
ALE
ALE (PD0) PORT D
RESET
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Data Byte Enable Reference Microcontrollers have different data byte orientations. The following table shows how the PSD interprets byte/word operations in different bus WRITE configurations. Even-byte refers to locations with address A0 equal to zero and odd byte as locations with A0 equal to one. Table 16. Eight-Bit Data Bus
BHE X X A0 0 1 D7-D0 Even Byte Odd Byte
MCU Bus Interface Examples Figure 23 to 26 show examples of the basic connections between the PSD and some popular MCUs. The PSD Control input pins are labeled as to the MCU function for which they are configured. The MCU bus interface is specified using the PSDsoft Express Configuration. The first configuration is 80C31-compatible, and the bus interface to the PSD is identical to that shown in Figure 23. The second and third configurations have the same bus connection as shown in Table 17., page 48. There is only one READ input (PSEN) connected to the CNTL1 pin on the PSD. The A16 connection to the PA0 pin allows for a larger address input to the PSD. Configuration 4 is shown in Figure 24., page 49. The RD signal is connected to Cntl1 and the PSEN signal is connected to the CNTL2. 80C31 Figure 23 shows the bus interface for the 80C31, which has an 8-bit multiplexed address/data bus. The lower address byte is multiplexed with the data bus. The MCU control signals Program Select Enable (PSEN, CNTL2), Read Strobe (RD, CNTL1), and Write Strobe (WR, CNTL0) may be used for accessing the internal memory and I/O Ports. The ALE input (pin PD0) latches the address.
Figure 23. Interfacing the PSD with an 80C31
AD7-AD0 AD[ 7:0 ]
80C31
31 19 18 9 12 13 14 15 1 2 3 4 5 6 7 8 EA/VP X1 X2 RESET INT0 INT1 T0 T1 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 RD WR PSEN ALE/P TXD RXD 39 38 37 36 35 34 33 32 21 22 23 24 25 26 27 28 17 16 29 30 11 10 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 RD WR PSEN ALE AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 30 31 32 33 34 35 36 37
PSD
ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 29 28 27 25 24 23 22 21
RESET
39 40 41 42 43 44 45 46
ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
7 6 5 4 3 2 52 51 20 19 18 17 14 13 12 11
47 50 49 10 9 8 48
CNTL0 (WR) CNTL1(RD) CNTL2 (PSEN) PD0-ALE PD1 PD2 RESET
RESET RESET
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80C251 The Intel 80C251 MCU features a user-configurable bus interface with four possible bus configurations, as shown in Table 18., page 49. The 80C251 has two major operating modes: Page Mode and Non-Page Mode. In Non-Page Mode, the data is multiplexed with the lower address byte, and ALE is active in every bus cycle.
In Page Mode, data D[7:0] is multiplexed with address A[15:8]. In a bus cycle where there is a Page hit, the ALE signal is not active and only addresses A[7:0] are changing. The PSD supports both modes. In Page Mode, the PSD bus timing is identical to Non-Page Mode except the address hold time and setup time with respect to ALE is not required. The PSD access time is measured from address A[7:0] valid to data in valid.
Table 17. Interfacing the PSD with the 80C251, with One READ Input
80C251SB
2 3 4 5 6 7 8 9 21 20 11 13 14 15 16 17
PSD
P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7
43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 A0 A1 A2 A3 A4 A5 A6 A7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 A0 A1 A2 A3 A4 A5 A6 A7 30 31 32 33 34 35 36 37
P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 X1 X2 P3.0/RXD P3.1/TXD P3.2/INT0 P3.3/INT1 P3.4/T0 P3.5/T1 RST EA
ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
29 28 27 25 24 23 22 21
A161 A171
AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15
39 40 41 42 43 44 45 46 47 50 49
ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 CNTL0 ( WR) CNTL1( RD) CNTL 2(PSEN) PD0-ALE PD1 PD2 RESET
7 6 5 4 3 2 52 51
RESET
10
ALE PSEN WR RD/A16
33 32 18 19
ALE RD WR A16
35
10 9 8
PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
20 19 18 17 14 13 12 11
RESET
RESET
48
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Note: 1. The A16 and A17 connections are optional. 2. In non-Page-Mode, AD7-AD0 connects to ADIO7-ADIO0.
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Figure 24. Interfacing the PSD with the 80C251, with RD and PSEN Inputs
80C251SB
2 3 4 5 6 7 8 9 21 20 11 13 14 15 16 17
PSD
P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7
43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 A0 A1 A2 A3 A4 A5 A6 A7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 A0 A1 A2 A3 A4 A5 A6 A7 30 31 32 33 34 35 36 37
P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 X1 X2 P3.0/RXD P3.1/TXD P3.2/INT0 P3.3/INT1 P3.4/T0 P3.5/T1 RST EA
ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7
PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
29 28 27 25 24 23 22 21
AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15
39 40 41 42 43 44 45 46 47 50 49
ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15 CNTL0 ( WR) CNTL1( RD) CNTL 2(PSEN) PD0-ALE PD1 PD2 RESET
7 6 5 4 3 2 52 51
RESET
10
ALE PSEN WR RD/A16
33 32 18 19
ALE RD WR PSEN
35
10 9 8
PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
20 19 18 17 14 13 12 11
RESET
RESET
48
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Table 18. 80C251 Configurations
Configuration 80C251 READ/WRITE Pins WR RD PSEN WR PSEN only WR PSEN only WR RD PSEN Connecting to PSD Pins CNTL0 CNTL1 CNTL2 CNTL0 CNTL1 CNTL0 CNTL1 CNTL0 CNTL1 CNTL2 Page Mode Non-Page Mode, 80C31 compatible A7-A0 multiplex with D7-D0 Non-Page Mode A7-A0 multiplex with D7-D0 Page Mode A15-A8 multiplex with D7-D0 Page Mode A15-A8 multiplex with D7-D0
1
2 3
4
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80C51XA The Philips 80C51XA microcontroller family supports an 8- or 16-bit multiplexed bus that can have burst cycles. Address bits (A3-A0) are not multiplexed, while (A19-A4) are multiplexed with data bits (D15-D0) in 16-bit mode. In 8-bit mode, (A11A4) are multiplexed with data bits (D7-D0). The 80C51XA can be configured to operate in eight-bit data mode. (shown in Figure 25).
The 80C51XA improves bus throughput and performance by executing Burst cycles for code fetches. In Burst Mode, address A19-A4 are latched internally by the PSD, while the 80C51XA changes the A3-A0 lines to fetch up to 16 bytes of code. The PSD access time is then measured from address A3-A0 valid to data in valid. The PSD bus timing requirement in Burst Mode is identical to the normal bus cycle, except the address setup and hold time with respect to ALE does not apply.
Figure 25. Interfacing the PSD with the 80C51X, 8-bit Data Bus
80C51XA
21 20 XTAL1 XTAL2 A0/WRH A1 A2 A3 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 A12D8 A13D9 A14D10 A15D11 A16D12 A17D13 A18D14 A19D15 2 3 4 5 43 42 41 40 39 38 37 36 24 25 26 27 28 29 30 31 A0 A1 A2 A3 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 A12 A13 A14 A15 A16 A17 A18 A19 A4D0 A5D1 A6D2 A7D3 A8D4 A9D5 A10D6 A11D7 30 31 32 33 34 35 36 37
PSD
ADIO0 ADIO1 ADIO2 ADIO3 AD104 AD105 ADIO6 ADIO7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 29 28 27 25 24 23 22 21 7 6 5 4 3 2 52 51 A0 A1 A2 A3
11 13 6 7
RXD0 TXD0 RXD1 TXD1
9 8 16
T2EX T2 T0
RESET
10 14 15
RST INT0 INT1
A12 A13 A14 A15 A16 A17 A18 A19
39 ADIO8 40 ADIO9 41 ADIO10 42 ADIO11 43 AD1012 44 AD1013 45 ADIO14 46 ADIO15
47 50 35 17 32 19 18 33 PSEN RD WR ALE 49 10 8 9 48
CNTL0 (WR) CNTL1(RD) CNTL 2(PSEN) PD0-ALE PD1 PD2 RESET
EA/WAIT BUSW
PSEN RD WRL ALE
PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
20 19 18 17 14 13 12 11
RESET
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68HC11 Figure 26 shows an interface to a 68HC11 where the PSD is configured in 8-bit multiplexed mode Figure 26. Interfacing the PSD with a 68HC11
AD7-AD0 AD7-AD0
with E and R/W settings. The DPLD can generate the READ and WR signals for external devices.
PSD 68HC11
8 7 RESET 17 19 18 2 34 33 32 XT EX RESET IRQ XIRQ MODB PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 31 30 29 28 27 42 41 40 39 38 37 36 35 9 10 11 12 13 14 15 16 20 21 22 23 24 25 3 5 E AS R/W 4 6 E AS R/W AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 A8 A9 A10 A11 A12 A13 A14 A15 30 31 32 33 34 35 36 37 39 40 41 42 43 44 45 46 ADIO0 ADIO1 ADIO2 ADIO3 AD104 AD105 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 AD1012 AD1013 ADIO14 ADIO15 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 29 28 27 25 24 23 22 21 7 6 5 4 3 2 52 51 20 19 18 17 14 13 12 11
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7 PD0 PD1 PD2 PD3 PD4 PD5 MODA
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7 PC0 PC1 PC2 PC3 PC4 PC5 PC6 PC7
43 44 45 46 47 48 49 50 52 51
PE0 PE1 PE2 PE3 PE4 PE5 PE6 PE7 VRH VRL
47 50 49 10 9 8 48
CNTL0 (R _W) CNTL1(E) CNTL 2 PD0 - AS PD1 PD2 RESET
RESET
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I/O PORTS
There are four programmable I/O ports: Ports A, B, C, and D. Each of the ports is eight bits except Port D, which is 3 bits. Each port pin is individually user configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft Express Configuration or by the MCU writing to onchip registers in the CSIOP address space. The topics discussed in this section are: General Port architecture Port Operating Modes Port Configuration Registers (PCR) Port Data Registers Individual Port Functionality. General Port Architecture The general architecture of the I/O Port is shown in Figure 27., page 53. Individual Port architectures are shown in Figure 29., page 60 to Figure 32., page 63. In general, once the purpose for a port pin has been defined, that pin will no longer be available for other purposes. Exceptions will be noted. As shown in Figure 27., page 53, the ports contain an output multiplexer whose selects are driven by the configuration bits in the Control Registers (Ports A and B only) and PSDsoft Express Configuration. Inputs to the multiplexer include the following: Output data from the Data Out Register Latched address outputs CPLD Macrocell output External Chip Select from CPLD. The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read. The PDB is connected to the Internal Data Bus for feedback and can be read by the microcontroller. The Data Out and Macrocell outputs, Direction and Control Registers, and port pin input are all connected to the PDB. The Port pin's tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND array enable product term and the Direction Register. If the enable product term of any of the array outputs are not defined and that port pin is not defined as a CPLD output in the PSDabel file, then the Direction Register has sole control of the buffer that drives the port pin. The contents of these registers can be altered by the microcontroller. The PDB feedback path allows the microcontroller to check the contents of the registers. Ports A, B, and C have embedded Input Macrocells (IMCs). The IMCs can be configured as latches, registers, or direct inputs to the PLDs. The latches and registers are clocked by the address strobe (AS/ALE) or a product term from the PLD AND array. The outputs from the IMCs drive the PLD input bus and can be read by the microcontroller. See the section entitled Input Macrocell, page 42. Port Operating Modes The I/O Ports have several modes of operation. Some modes can be defined using PSDabel, some by the microcontroller writing to the Control Registers in CSIOP space, and some by both. The modes that can only be defined using PSDsoft Express must be programmed into the device and cannot be changed unless the device is reprogrammed. The modes that can be changed by the microcontroller can be done so dynamically at runtime. The PLD I/O, Data Port, Address Input, and Peripheral I/O modes are the only modes that must be defined before programming the device. All other modes can be changed by the microcontroller at run-time. Table 19., page 54 summarizes which modes are available on each port. Table 22., page 57 shows how and where the different modes are configured. Each of the port operating modes are described in the following subsections.
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Figure 27. General I/O Port Architecture
DATA OUT REG. D WR ADDRESS ALE D G Q ADDRESS OUTPUT MUX PORT PIN Q
DATA OUT
MACROCELL OUTPUTS EXT CS
INTERNAL DATA BUS
READ MUX P D B DATA IN OUTPUT SELECT
CONTROL REG. D WR DIR REG. D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL CPLD- INPUT
AI02885
Q
ENABLE OUT
Q
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MCU I/O Mode In the MCU I/O Mode, the microcontroller uses the PSD ports to expand its own I/O ports. By setting up the CSIOP space, the ports on the PSD are mapped into the microcontroller address space. The addresses of the ports are listed in Table 6., page 17. A port pin can be put into MCU I/O mode by writing a `0' to the corresponding bit in the Control Register. The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Register, or by the output enable product term. See the section entitled Peripheral I/O Mode, page 56. When the pin is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the microcontroller can read the port input through the Data In buffer. See Figure 27., page 53. Ports C and D do not have Control Registers, and are in MCU I/O mode by default. They can be used for PLD I/O if equation are written for them in PSDabel. PLD I/O Mode The PLD I/O Mode uses a port as an input to the CPLD's Input Macrocells, and/or as an output from the CPLD's Output Macrocells. The output can be tri-stated with a control signal. This output enable control signal can be defined by a product term Table 19. Port Operating Modes
Port Mode MCU I/O PLD I/O McellAB Outputs McellBC Outputs Additional Ext. CS Outputs PLD Inputs Address Out Address In Data Port Peripheral I/O JTAG ISP Yes Yes No No Yes Yes (A7-A0 Yes Yes (D7-D0) Yes No Port A Yes Yes Yes No Yes Yes (A7-A0) or (A15-A8) Yes No No No Port B Yes No Yes No Yes No Yes No No Yes1 Port C Yes No No Yes Yes No Yes No No No Port D
from the PLD, or by setting the corresponding bit in the Direction Register to `0.' The corresponding bit in the Direction Register must not be set to `1' if the pin is defined as a PLD input pin in PSDabel. The PLD I/O Mode is specified in PSDabel by declaring the port pins, and then writing an equation assigning the PLD I/O to a port. Address Out Mode For microcontrollers with a multiplexed address/ data bus, Address Out Mode can be used to drive latched addresses onto the port pins. These port pins can, in turn, drive external devices. Either the output enable or the corresponding bits of both the Direction Register and Control Register must be set to a `1' for pins to use Address Out Mode. This must be done by the MCU at run-time. See Table 21., page 55 for the address output pin assignments on Ports A and B for various MCUs. For non-multiplexed 8-bit bus mode, address lines A7-A0 are available to Port B in Address Out Mode. Note: do not drive address lines with Address Out Mode to an external memory device if it is intended for the MCU to boot from the external device. The MCU must first boot from PSD memory so the Direction and Control register bits can be set.
Note: 1. Can be multiplexed with other I/O functions.
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Table 20. Port Operating Mode Settings
Mode Defined in PSDabel Defined in PSD Configuration Control Register Setting 0 N/A N/A 1 N/A N/A Direction Register Setting VM Register Setting JTAG Enable
MCU I/O PLD I/O Data Port (Port A)
Declare pins only Logic equations N/A
N/A1 N/A Specify bus type N/A N/A N/A
1 = output, 0 = input N/A (Note 2) (Note 2) N/A 1 (Note 2) N/A N/A N/A N/A N/A N/A N/A
N/A N/A N/A N/A N/A
Address Out (Port A,B) Declare pins only Address In (Port A,B,C,D) Peripheral I/O (Port A) JTAG ISP (Note 3) Logic equation for Input Macrocells Logic equations (PSEL0 & 1) JTAGSEL
PIO bit = 1 N/A N/A JTAG_Enable
JTAG Configuration N/A
Note: 1. N/A = Not Applicable 2. The direction of the Port A,B,C, and D pins are controlled by the Direction Register ORed with the individual output enable product term (.oe) from the CPLD AND Array. 3. Any of these three methods enables the JTAG pins on Port C.
Table 21. I/O Port Latched Address Output Assignments
MCU 8051XA (8-Bit) 80C251 (Page Mode) All Other 8-Bit Multiplexed 8-Bit Non-Multiplexed Bus Port A (PA3-PA0) N/A1 N/A Address A3-A0 N/A Port A (PA7-PA4) Address a7-a4 N/A Address A7-A4 N/A Port B (PB3-PB0) Address A11-A8 Address A11-A8 Address A3-A0 Address A3-A0 Port B (PB7-PB4) N/A Address A15-A12 Address A7-A4 Address A7-A4
Note: 1. N/A = Not Applicable.
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Address In Mode For microcontrollers that have more than 16 address lines, the higher addresses can be connected to Port A, B, C, and D. The address input can be latched in the Input Macrocell by the address strobe (ALE/AS). Any input that is included in the DPLD equations for the PLD's Flash, EEPROM, or SRAM is considered to be an address input. Data Port Mode Port A can be used as a data bus port for a microcontroller with a non-multiplexed address/data bus. The Data Port is connected to the data bus of the microcontroller. The general I/O functions are disabled in Port A if the port is configured as a Data Port. Figure 28. Peripheral I/O Mode
RD PSEL0 PSEL PSEL1 D0 - D7 DATA BUS
Peripheral I/O Mode Peripheral I/O Mode can be used to interface with external peripherals. In this mode, all of Port A serves as a tri-stateable, bi-directional data buffer for the microcontroller. Peripheral I/O Mode is enabled by setting Bit 7 of the VM Register to a `1.' Figure 28 shows how Port A acts as a bi-directional buffer for the microcontroller data bus if Peripheral I/O Mode is enabled. An equation for PSEL0 and/or PSEL1 must be written in PSDabel. The buffer is tri-stated when PSEL 0 or PSEL1 is not active.
VM REGISTER BIT 7
PA0 - PA7
WR
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JTAG In-System Programming (ISP) Port C is JTAG compliant, and can be used for InSystem Programming (ISP). You can multiplex JTAG operations with other functions on Port C because ISP is not performed during normal system operation. For more information on the JTAG Port, see the section entitled PROGRAMMING INCIRCUIT USING THE JTAG SERIAL INTERFACE, page 71. Port Configuration Registers (PCR) Each Port has a set of Port Configuration Registers (PCR) used for configuration. The contents of the registers can be accessed by the MCU through normal READ/WRITE bus cycles at the addresses given in Table 6., page 17. The addresses in Table 6., page 17 are the offsets in hexadecimal from the base of the CSIOP register.
The pins of a port are individually configurable and each bit in the register controls its respective pin. For example, Bit 0 in a register refers to Bit 0 of its port. The three Port Configuration Registers (PCR), shown in Table 22, are used for setting the Port configurations. The default Power-up state for each register in Table 22 is 00h. Control Register Any bit reset to `0' in the Control Register sets the corresponding port pin to MCU I/O Mode, and a `1' sets it to Address Out Mode. The default mode is MCU I/O. Only Ports A and B have an associated Control Register. Table 22. Port Configuration Registers (PCR)
Register Name Control Direction Drive Select1 A,B A,B,C,D A,B,C,D Port MCU Access WRITE/READ WRITE/READ WRITE/READ
Note: 1. See Table 26., page 58 for Drive Register bit definition.
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Direction Register The Direction Register, in conjunction with the output enable (except for Port D), controls the direction of data flow in the I/O Ports. Any bit set to `1' in the Direction Register will cause the corresponding pin to be an output, and any bit set to `0' will cause it to be an input. The default mode for all port pins is input. Figure 29., page 60 and Figure 30., page 61 show the Port Architecture diagrams for Ports A/B and C, respectively. The direction of data flow for Ports A, B, and C are controlled not only by the direction register, but also by the output enable product term from the PLD AND array. If the output enable product term is not active, the Direction Register has sole control of a given pin's direction. An example of a configuration for a port with the three least significant bits set to output and the remainder set to input is shown in Table 25. Since Port D only contains three pins (shown in Figure 32., page 63), the Direction Register for Port D has only the three least significant bits active. Drive Select Register The Drive Select Register configures the pin driver as Open Drain or CMOS for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain. A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a `1.' The default pin drive is CMOS. Aside: the slew rate is a measurement of the rise and fall times of an output. A higher slew rate means a faster output response and may create Table 26. Drive Register Pin Assignment
Drive Register Port A Port B Port C Port D Bit 7 Open Drain Open Drain Open Drain NA1 Bit 6 Open Drain Open Drain Open Drain NA1 Bit 5 Open Drain Open Drain Open Drain NA1 Bit 4 Open Drain Open Drain Open Drain NA1 Bit 3 Slew Rate Slew Rate Open Drain NA1 Bit 2 Slew Rate Slew Rate Open Drain Slew Rate Bit 1 Slew Rate Slew Rate Open Drain Slew Rate Bit 0 Slew Rate Slew Rate Open Drain Slew Rate
more electrical noise. A pin operates in a high slew rate when the corresponding bit in the Drive Register is set to `1.' The default rate is slow slew. Table 26 shows the Drive Register for Ports A, B, C, and D. It summarizes which pins can be configured as Open Drain outputs and which pins the slew rate can be set for. Table 23. Port Pin Direction Control, Output Enable P.T. Not Defined
Direction Register Bit 0 1 Input Output Port Pin Mode
Table 24. Port Pin Direction Control, Output Enable P.T. Defined
Direction Register Bit 0 0 1 1 Output Enable P.T. 0 1 0 1 Port Pin Mode Input Output Output Output
Table 25. Port Direction Assignment Example
Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 1 Bit 1 1 Bit 0 1
Note: 1. NA = Not Applicable.
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Port Data Registers The Port Data Registers, shown in Table 27, are used by the MCU to write data to or read data from the ports. Table 27 shows the register name, the ports having each register type, and MCU access for each register type. The registers are described below. Data In Port pins are connected directly to the Data In buffer. In MCU I/O input mode, the pin input is read through the Data In buffer. Data Out Register Stores output data written by the MCU in the MCU I/O output mode. The contents of the Register are driven out to the pins if the Direction Register or the output enable product term is set to `1.' The contents of the register can also be read back by the MCU.
Output Macrocells (OMC) The CPLD Output Macrocells (OMC) occupy a location in the microcontroller's address space. The microcontroller can read the output of the OMCs. If the Mask Macrocell Register bits are not set, writing to the Macrocell loads data to the Macrocell flip flops. See the section entitled PLD'S, page 34. Mask Macrocell Register Each Mask Register bit corresponds to an OMC flip flop. When the Mask Register bit is set to a "1", loading data into the OMC flip flop is blocked. The default value is "0" or unblocked. Input Macrocells (IMC) The IMCs can be used to latch or store external inputs. The outputs of the IMCs are routed to the PLD input bus, and can be read by the microcontroller. Refer to the section entitled PLD'S, page 34 for a detailed description.
Table 27. Port Data Registers
Register Name Data In Data Out Output Macrocell Mask Macrocell Input Macrocell Enable Out Port A,B,C,D A,B,C,D A,B,C A,B,C A,B,C A,B,C READ - input on pin WRITE/READ READ - outputs of macrocells WRITE - loading macrocell flip-flop WRITE/READ - prevents loading into a given macrocell READ - outputs of the Input Macrocells READ - the output enable control of the port driver MCU Access
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Enable Out The Enable Out register can be read by the microcontroller. It contains the output enable values for a given port. A `1' indicates the driver is in output mode. A `0' indicates the driver is in tri-state and the pin is in input mode. Ports A and B - Functionality and Structure Ports A and B have similar functionality and structure, as shown in Figure 29. The two ports can be configured to perform one or more of the following functions: MCU I/O Mode CPLD Output - Macrocells McellAB7McellAB0 can be connected to Port A or Port B. McellBC7-McellBC0 can be connected to Port B or Port C. Figure 29. Port A and Port B Structure
DATA OUT REG. D WR ADDRESS ALE D G Q ADDRESS A[ 7:0] OR A[15:8] OUTPUT MUX PORT A OR B PIN Q

CPLD Input - Via the Input Macrocells (IMC). Latched Address output - Provide latched address output as per Table 21., page 55. Address In - Additional high address inputs using the Input Macrocells (IMC). Open Drain/Slew Rate - pins PA3-PA0 and PB3-PB0 can be configured to fast slew rate, pins PA7-PA4 and PB7-PB4 can be configured to Open Drain Mode. Data Port - Port A to D7-D0 for 8 bit nonmultiplexed bus Multiplexed Address/Data port for certain types of MCU bus interfaces. Peripheral Mode - Port A only
DATA OUT
MACROCELL OUTPUTS READ MUX P D B CONTROL REG. D WR DIR REG. D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL Q Q ENABLE OUT DATA IN OUTPUT SELECT
INTERNAL DATA BUS
CPLD - INPUT
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Port C - Functionality and Structure Port C can be configured to perform one or more of the following functions (see Figure 30): MCU I/O Mode CPLD Output - McellBC7-McellBC0 outputs can be connected to Port B or Port C. CPLD Input - via the Input Macrocells (IMC) Address In - Additional high address inputs using the Input Macrocells (IMC). In-System Programming (ISP) - JTAG port can be enabled for programming/erase of the PSD device. (See the section entitled PROGRAMMING IN-CIRCUIT USING THE
JTAG SERIAL INTERFACE, page 71, for more information on JTAG programming.) Open Drain - Port C pins can be configured in Open Drain Mode Battery Backup features - PC2 can be configured as a battery input pin (VSTBY). PC4 can be configured as a Battery-on Indicator output pin (VBATON), indicating when VCC is less than VBAT. Port C does not support Address Out mode, and therefore no Control Register is required. Pin PC7 may be configured as the DBE input in certain MCU interfaces.
Figure 30. Port C Structure
DATA OUT REG. D WR 1 SPECIAL FUNCTION PORT C PIN OUTPUT MUX Q DATA OUT
MCELLBC[ 7:0] READ MUX
INTERNAL DATA BUS
P D B DATA IN
OUTPUT SELECT
ENABLE OUT
DIR REG. D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL 1 SPECIAL FUNCTION Q
CPLD - INPUT
CONFIGURATION AI02888B BIT
Note: 1. ISP or battery back-up.
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Port D - Functionality and Structure Port D has three I/O pins. See Figure 31 and Figure 32., page 63. This port does not support Address Out mode, and therefore no Control Register is required. Port D can be configured to perform one or more of the following functions: MCU I/O Mode CPLD Output - External Chip Select (ECS0ECS2) CPLD Input - direct input to the CPLD, no Input Macrocells (IMC) Slew rate - pins can be set up for fast slew rate Figure 31. Port D Structure
DATA OUT REG. DATA OUT D WR PORT D PIN OUTPUT MUX ECS[ 2:0] READ MUX Q
Port D pins can be configured in PSDsoft Express as input pins for other dedicated functions: PD0 - ALE, as address strobe input PD1 - CLKIN, as clock input to the macrocells flip-flops and APD counter PD2 - CSI, as active Low chip select input. A High input will disable the Flash memory, EEPROM, SRAM and CSIOP.
INTERNAL DATA BUS
P D B DATA IN
OUTPUT SELECT
DIR REG. D WR Q CPLD-INPUT
ENABLE PRODUCT TERM (.OE)
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External Chip Select The CPLD also provides three External Chip Select (ECS0-ECS2) outputs on Port D pins that can be used to select external devices. Each External Chip Select (ECS0-ECS2) consists of one product Figure 32. Port D External Chip Select Signals
term that can be configured active High or Low. The output enable of the pin is controlled by either the output enable product term or the Direction Register. (See Figure 32.)
ENABLE (.OE)
DIRECTION REGISTER
PT0
ECS0 POLARITY BIT ENABLE (.OE) DIRECTION REGISTER
PD0 PIN
CPLD AND ARRAY
PLD INPUT BUS
PT1
ECS1 POLARITY BIT ENABLE (.OE) DIRECTION REGISTER
PD1 PIN
PT2
ECS2
PD2 PIN
POLARITY BIT
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POWER MANAGEMENT
The PSD offers configurable power saving options. These options may be used individually or in combinations, as follows: - All memory types in a PSD (Flash, EEPROM, and SRAM) are built with Zero-Power technology. In addition to using special silicon design methodology, Zero-Power technology puts the memories into standby mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected memory "wakes up", changes and latches its outputs, then goes back to standby. The designer does not have to do anything special to achieve memory standby mode when no inputs are changing-- it happens automatically. The PLD sections can also achieve standby mode when its inputs are not changing, as described in the section entitled PLD Power Management, page 66. - Like the Zero-Power feature, the Automatic Power Down (APD) logic allows the PSD to reduce to standby current automatically. The APD will block MCU address/data signals from reaching the memories and PLDs. This feature is available on all PSD devices. The APD Unit is described in more detail in the sections entitled Automatic Power-down (APD) Unit and Power-down Mode, page 65. Built in logic will monitor the address strobe of the MCU for activity. If there is no activity for a certain time period (MCU is asleep), the APD logic initiates Power Down Mode (if enabled). Once in Power Down Mode, all address/data signals are blocked from reaching PSD memories and PLDs, and the memories are deselected internally. This allows the memories and PLDs to remain in standby mode even if the address/data lines are changing state externally (noise, other devices on the MCU bus, etc.). Keep in mind that any unblocked PLD input signals that are changing states keeps the PLD out of standby mode, but not the memories. The PSD Chip Select Input (CSI) on all families can be used to disable the internal memories, placing them in standby mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. This is a good alternative to using the APD logic, especially if your MCU has a chip select output. There is a slight penalty in memory access time when the CSI signal makes its initial transition from deselected to selected. The PMMR registers can be written by the MCU at run-time to manage power. PSD supports "blocking bits" in these registers that are set to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their inputs (see Figure 36., page 73 and Figure 37., page 73). Significant power savings can be achieved by blocking signals that are not used in DPLD or CPLD logic equations. The PSD has a Turbo Bit in the PMMR0 register. This bit can be set to disable the Turbo Mode feature (default is Turbo Mode on). While Turbo Mode is disabled, the PLDs can achieve standby current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current), compared to when Turbo Mode is enabled. When the Turbo Mode is enabled, there is a significant DC current component and the AC component is higher.
-
-
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Automatic Power-down (APD) Unit and Power-down Mode The APD Unit, shown in Figure 33, puts the PSD setting the appropriate bits in the PMMR into Power-down mode by monitoring the activity registers. The blocked signals include MCU of Address Strobe (ALE/AS, PD0). If the APD Unit control signals and the common clock is enabled, as soon as activity on Address Strobe (CLKIN). Note that blocking CLKIN from the (ALE/AS, PD0) stops, a four bit counter starts PLDs will not block CLKIN from the APD unit. counting. If Address Strobe (ALE/AS, PD0) re- All PSD memories enter Standby Mode and mains inactive for fifteen clock periods of CLKIN are drawing standby current. However, the (PD1), the Power-down (PDN) signal becomes acPLDs and I/O ports do not go into Standby tive, and the PSD enters Power-down mode, as Mode because you don't want to have to wait discussed next. for the logic and I/O to "wake-up" before their Power-down Mode outputs can change. See Table 28 for Power Down Mode effects on PSD ports. By default, if you enable the PSD APD unit, Power Down Mode is automatically enabled. The device - Typical standby current are of the order of the will enter Power Down Mode if the address strobe microampere (see Table 29). These standby (ALE/AS) remains inactive for fifteen CLKIN (pin current values assume that there are no PD1) clock periods. transitions on any PLD input. The following should be kept in mind when the PSD is in Power Down Mode: Table 28. Power-down Mode's Effect on Ports - If the address strobe starts pulsing again, the Port Function Pin Level PSD will return to normal operation. The PSD MCU I/O No Change will also return to normal operation if either the CSI input returns low or the Reset input PLD Out No Change returns high. Address Out Undefined - The MCU address/data bus is blocked from all memories and PLDs. Data Port Tri-State - Various signals can be blocked (prior to Power Peripheral I/O Tri-State Down Mode) from entering the PLDs by Figure 33. APD Unit
APD EN PMMR0 BIT 1=1 TRANSITION DETECTION ALE CLR PD EEPROM SELECT FLASH SELECT EDGE DETECT PD PLD SRAM SELECT POWER DOWN (PDN) SELECT DISABLE BUS INTERFACE
RESET CSI CLKIN
APD COUNTER
DISABLE FLASH/EEPROM/SRAM
AI02891
Table 29. PSD Timing and Stand-by Current during Power-down Mode
Mode Power-down PLD Propagation Delay Normal tPD(1) Memory Access Time No Access Access Recovery Time to Normal Access tLVDV Typical Stand-by Current 5V VCC 50A(2) 3V VCC 25A(2)
Note: 1. Power-down does not affect the operation of the PLD. The PLD operation in this mode is based only on the Turbo bit. 2. Typical current consumption assuming no PLD inputs are changing state and the PLD Turbo bit is 0.
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For Users of the HC11 (or compatible) The HC11 turns off its E clock when it sleeps. Therefore, if you are using an HC11 (or compatible) in your design, and you wish to use the Power-down mode, you must not connect the E clock to CLKIN (PD1). You should instead connect an independent clock signal to the CLKIN input (PD1). The clock frequency must be less than 15 times the frequency of AS. The reason for this is that if the frequency is greater than 15 times the frequency of AS, the PSD will keep going into Power-down mode. Other Power Saving Options The PSD offers other reduced power saving options that are independent of the Power-down mode. Except for the SRAM Stand-by and Chip Select Input (CSI, PD2) features, they are enabled by setting bits in the PMMR0 and PMMR2 registers. PLD Power Management The power and speed of the PLDs are controlled by the Turbo bit (bit 3) in the PMMR0. By setting the bit to `1', the Turbo mode is disabled and the PLDs consume Zero Power current when the inputs are not switching for an extended time of 70ns. The propagation delay time will be increased by 10ns after the Turbo bit is set to `1' (turned off) when the inputs change at a composite frequency of less than 15 MHz. When the Turbo bit is set to a `0' (turned on), the PLDs run at full power and speed. The Turbo bit affects the PLD's D.C. power, AC power, and propagation delay. Note: Blocking MCU control signals with PMMR2 bits can further reduce PLD AC power consumption. SRAM Standby Mode (Battery Backup) The PSD supports a battery backup operation that retains the contents of the SRAM in the event of a power loss. The SRAM has a VSTBY pin (PC2) that can be connected to an external battery. When VCC becomes lower than VSTBY then the PSD will automatically connect to VSTBY as a power source to the SRAM. The SRAM Standby Current (ISTBY) is typically 0.5A. The SRAM data retention voltage is 2 V minimum. The battery-on indicator (VBATON) can be routed to PC4. This signal indicates when the VCC has dropped below the VSTBY voltage. PSD Chip Select Input (CSI, PD2) Pin PD2 of Port D can be configured in PSDsoft Express as the CSI input. When low, the signal selects and enables the internal Flash, EEPROM, SRAM, and I/O for READ or WRITE operations involving the PSD. A high on the CSI pin will disable the Flash memory, EEPROM, and SRAM, and reduce the PSD power consumption. However, the PLD and I/O pins remain operational when CSI is High. Note: There may be a timing penalty when using the CSI pin depending on the speed grade of the PSD that you are using. See the timing parameter tSLQV in Table 63., page 95 or Table 64., page 95. Input Clock The PSD provides the option to turn off the CLKIN input to the PLD to save AC power consumption. The CLKIN is an input to the PLD AND array and the Output Macrocells. During Power Down Mode, or, if the CLKIN input is not being used as part of the PLD logic equation, the clock should be disabled to save AC power. The CLKIN will be disconnected from the PLD AND array or the Macrocells by setting bits 4 or 5 to a `1' in PMMR0. Figure 34. Enable Power-down Flow Chart
RESET
Enable APD Set PMMR0 Bit 1 = 1
OPTIONAL
Disable desired inputs to PLD by setting PMMR0 bits 4 and 5 and PMMR2 bits 2 through 6.
No
ALE/AS idle for 15 CLKIN clocks? Yes PSD in Power Down Mode
AI02892
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Table 30. Power Management Mode Registers PMMR0 (Note 1)
Bit 0 Bit 1 Bit 2 Bit 3 X APD Enable 1 = on Automatic Power-down (APD) is enabled. X PLD Turbo 1 = off PLD Turbo mode is off, saving power. 0 = on Bit 4 PLD Array clk CLKIN (PD1) input to the PLD AND Array is connected. Every change of CLKIN (PD1) Powers-up the PLD when Turbo bit is 0. 0 Not used, and should be set to zero. 0 Not used, and should be set to zero. 0 = off Automatic Power-down (APD) is disabled.
0 = on PLD Turbo mode is on
1 = off CLKIN (PD1) input to PLD AND Array is disconnected, saving power. 0 = on CLKIN (PD1) input to the PLD macrocells is connected. Bit 5 Bit 6 Bit 7 PLD MCell clk 1 = off CLKIN (PD1) input to PLD macrocells is disconnected, saving power. X X 0 0 Not used, and should be set to zero. Not used, and should be set to zero.
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the registers.
Table 31. Power Management Mode Registers PMMR2 (Note 1)
Bit 0 Bit 1 Bit 2 X X PLD Array CNTL0 PLD Array CNTL1 PLD Array CNTL2 PLD Array ALE PLD Array DBE X 0 0 Not used, and should be set to zero. Not used, and should be set to zero.
0 = on Cntl0 input to the PLD AND Array is connected. 1 = off Cntl0 input to PLD AND Array is disconnected, saving power. 0 = on Cntl1 input to the PLD AND Array is connected. 1 = off Cntl1 input to PLD AND Array is disconnected, saving power. 0 = on Cntl2 input to the PLD AND Array is connected. 1 = off Cntl2 input to PLD AND Array is disconnected, saving power. 0 = on ALE input to the PLD AND Array is connected. 1 = off ALE input to PLD AND Array is disconnected, saving power. 0 = on DBE input to the PLD AND Array is connected. 1 = off DBE input to PLD AND Array is disconnected, saving power. 0 Not used, and should be set to zero.
Bit 3
Bit 4
Bit 5
Bit 6 Bit 7
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (RESET) pulses do not clear the registers.
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Input Control Signals The PSD provides the option to turn off the input control signals (CNTL0, CNTL1, CNTL2, ALE, and DBE) to the PLD to save AC power consumption. These control signals are inputs to the PLD AND array.
During Power Down Mode, or, if any of them are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They will be disconnected from the PLD AND array by setting bits 2, 3, 4, 5, and 6 to a `1' in the PMMR2.
Table 32. APD Counter Operation
APD Enable Bit 0 1 1 1 ALE PD Polarity X X 1 0 ALE Level X Pulsing 1 0 Not Counting Not Counting Counting (Generates PDN after 15 Clocks) Counting (Generates PDN after 15 Clocks) APD Counter
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RESET TIMING AND DEVICE STATUS AT RESET
Power-On Reset Upon Power-up, the PSD requires a Reset (RESET) pulse of duration tNLNH-PO (See Tables 67 and 68 for values) after VCC is steady. During this period, the device loads internal configurations, clears some of the registers and sets the Flash memory or EEPROM into Operating mode. After the rising edge of Reset (RESET), the PSD remains in the Reset mode for an additional period, tOPR (See Tables 67 and 68 for values), before the first memory access is allowed. The PSD Flash or EEPROM memory is reset to the READ mode upon power up. The FSi and EESi select signals along with the write strobe signal must be in the false state during power-up reset for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of a write strobe signal. The PSD automatically prevents write strobes from reaching the EEPROM memory array for about 5ms (tEEHWL). Any Flash memory WRITE cycle initiation is prevented automatically when VCC is below VLKO. Figure 35. Reset (RESET) Timing Warm Reset Once the device is up and running, the device can be reset with a much shorter pulse of tNLNH (See Tables 67 and 68 for values). The same tOPR time is needed before the device is operational after warm reset. Figure 35 shows the timing of the power on and warm reset. I/O Pin, Register and PLD Status at Reset Table 33., page 70 shows the I/O pin, register and PLD status during Power On Reset, Warm reset and Power-down mode. PLD outputs are always valid during warm reset, and they are valid in Power On Reset once the internal PSD Configuration bits are loaded. This loading of PSD is completed typically long before the VCC ramps up to operating level. Once the PLD is active, the state of the outputs are determined by the PSDabel equations.
VCC
VCC(min) tNLNH tNLNH-A Warm Reset
tNLNH-PO Power-On Reset
tOPR
tOPR
RESET
AI02866b
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Table 33. Status During Power-On Reset, Warm Reset and Power-down Mode
Port Configuration MCU I/O PLD Output Address Out Data Port Peripheral I/O Power-On Reset Input mode Valid after internal PSD configuration bits are loaded Tri-stated Tri-stated Tri-stated Warm Reset Input mode Valid Tri-stated Tri-stated Tri-stated Power-down Mode Unchanged Depends on inputs to PLD (addresses are blocked in PD mode) Not defined Tri-stated Tri-stated
Register PMMR0 and PMMR2 Macrocells flip-flop status
Power-On Reset Cleared to `0' Cleared to `0' by internal Power-On Reset Initialized, based on the selection in PSDsoft Express Configuration menu Cleared to `0'
Warm Reset Unchanged Depends on .re and .pr equations Initialized, based on the selection in PSDsoft Express Configuration menu Cleared to `0'
Power-down Mode Unchanged Depends on .re and .pr equations
VM Register
1
Unchanged
All other registers
Unchanged
Note: 1. The SR_cod and PeriphMode bits in the VM Register are always cleared to `0' on Power-On Reset or Warm Reset.
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PROGRAMMING IN-CIRCUIT USING THE JTAG SERIAL INTERFACE
The JTAG interface on the PSD can be enabled on Port C (see Table 34., page 72). All memory (Flash and EEPROM), PLD logic, and PSD configuration bits may be programmed through the JTAG interface. A blank part can be mounted on a printed circuit board and programmed using JTAG. The standard JTAG signals (IEEE 1149.1) are TMS, TCK, TDI, and TDO. Two additional signals, TSTAT and TERR, are optional JTAG extensions used to speed up program and erase operations. Note: By default, on a blank PSD (as shipped from factory or after erasure), four pins on Port C are enabled for the basic JTAG signals TMS, TCK, TDI, and TDO. Standard JTAG Signals The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are logically ORed. When enabled, TDI, TDO, TCK, and TMS are inputs, waiting for a serial command from an external JTAG controller device (such as FlashLink or Automated Test Equipment). When the enabling command is received from the external JTAG controller, TDO becomes an output and the JTAG channel is fully functional inside the PSD. The same command that enables the JTAG channel may optionally enable the two additional JTAG pins, TSTAT and TERR. The following symbolic logic equation specifies the conditions enabling the four basic JTAG pins (TMS, TCK, TDI, and TDO) on their respective Port C pins. For purposes of discussion, the logic label JTAG_ON will be used. When JTAG_ON is true, the four pins are enabled for JTAG. When JTAG_ON is false, the four pins can be used for general PSD I/O. JTAG_ON = PSDsoft_enabled + /* An NVM configuration bit inside the PSD is set by the designer in the PSDsoft Express Configuration utility. This dedicates the pins for JTAG at all times (compliant with IEEE 1149.1) */ Microcontroller_enabled + /* The microcontroller can set a bit at runtime by writing to the PSD register, JTAG Enable. This register is located at address CSIOP + offset C7h. Setting the JTAG_ENABLE bit in this register will enable the pins for JTAG use. This bit is cleared by a PSD reset or the microcontroller. See Table 35., page 72 for bit definition. */ PSD_product_term_enabled; /* A dedicated product term (PT) inside the PSD can be used to enable the JTAG pins. This PT has the reserved name JTAGSEL. Once defined as a node in PSDabel, the designer can write an equation for JTAGSEL. This method is used when the Port C JTAG pins are multiplexed with other I/O signals. It is recommended to logically tie the node JTAGSEL to the JEN\ signal on the Flashlink cable when multiplexing JTAG signals. (AN1153) The PSD supports JTAG In-System-Configuration (ISC) commands, but not Boundary Scan. A definition of these JTAG-ISC commands and sequences are defined in a supplemental document available from ST. ST's PSDsoft Express software tool and FlashLink JTAG programming cable implement these JTAG-ISC commands. This document is needed only as a reference for designers who use a FlashLink to program their PSD.
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JTAG Extensions TSTAT and TERR are two JTAG extension signals enabled by an "ISC_ENABLE" command received over the four standard JTAG pins (TMS, TCK, TDI, and TDO). They are used to speed programming and erase functions by indicating status on PSD pins instead of having to scan the status out serially using the standard JTAG channel. TERR will indicate if an error has occurred when erasing a sector or programming a byte in Flash memory. This signal will go Low (active) when an error condition occurs, and stay Low until an "ISC_CLEAR" command is executed or a chip reset pulse is received after an "ISC-DISABLE" command. TERR does not apply to EEPROM. TSTAT behaves the same as the Ready/Busy signal described in the section entitled Ready/Busy Pin (PC3), page 18. TSTAT will be High when the PSD device is in READ mode (Flash memory and EEPROM contents can be read). TSTAT will be Low when Flash memory programming or erase cycles are in progress, and also when data is being written to EEPROM. TSTAT and TERR can be configured as opendrain type signals during an "ISC_ENABLE" command. This facilitates a wired-OR connection of TSTAT signals from several PSD devices and a wired-OR connection of TERR signals from those same devices. This is useful when several PSD devices are "chained" together in a JTAG environment. Security, Flash memory and EEPROM Protection When the security bit is set, the device cannot be read on a device programmer or through the JTAG Port. When using the JTAG Port, only a full chip erase command is allowed. All other program/ erase/verify commands are blocked. Full chip erase returns the part to a non-secured blank state. The Security Bit can be set in PSDsoft Express Configuration. All Flash Memory and EEPROM sectors can individually be sector protected against erasures. The sector protect bits can be set in PSDsoft Express Configuration. Table 34. JTAG Port Signals
Port C Pin PC0 PC1 PC3 PC4 PC5 PC6 JTAG Signals TMS TCK TSTAT TERR TDI TDO Description Mode Select Clock Status Error Flag Serial Data In Serial Data Out
INITIAL DELIVERY STATE
When delivered from ST, the PSD device has all bits in the memory and PLDs set to '1.' The PSD Configuration Register bits are set to '0.' The code, configuration, and PLD logic are loaded using the Table 35. JTAG Enable Register
0 = off JTAG port is disabled. Bit 0 Bit 1 Bit 2 Bit 3 Bit 4 Bit 5 Bit 6 Bit 7 JTAG_Enable 1 = on JTAG port is enabled. X X X X X X X 0 0 0 0 0 0 0 Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero.
programming procedure. Information for programming the device is available directly from ST. Please contact your local sales representative.
Note: The state of Reset (RESET) does not interrupt (or prevent) JTAG operations if the JTAG signals are dedicated by an NVM Configuration bit (via PSDsoft Express). However, Reset (RESET) prevents or interrupts JTAG operations if the JTAG enable register is used to enable the JTAG signals.
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AC/DC PARAMETERS
The following tables describe the AD and DC parameters of the PSD: DC Electrical Specification AC Timing Specification PLD Timing - Combinatorial Timing - Synchronous Clock Mode - Asynchronous Clock Mode - Input Macrocell Timing MCU Timing - READ Timing - WRITE Timing - Peripheral Mode Timing - Power-down and Reset Timing The following are issues concerning the parameters presented: In the DC specification the supply current is given for different modes of operation. Before calculating the total power consumption, determine the percentage of time that the PSD is in each mode. Also, the supply power is considerably different if the Turbo bit is `0.' The AC power component gives the PLD, EEPROM and SRAM mA/MHz specification. Figures 36 and 37 show the PLD mA/MHz as a function of the number of Product Terms (PT) used. In the PLD timing parameters, add the required delay when Turbo bit is `0.'
Figure 36. PLD ICC /Frequency Consumption (5V range)
110 100 90 80 ICC - (mA) 70
FF O
VCC = 5V
%) (100 ON BO TUR
60
TU RB
50 40 30 20 10 0 0 5
T
O
O URB
ON
(25%
)
O RB TU
F OF
PT 100% PT 25%
10
15
20
25
AI02894
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
Figure 37. PLD ICC /Frequency Consumption (3V range)
60 VCC = 3V 50 ICC - (mA) 40
BO TUR ON ( 100% )
O FF
30 20 10
TU RB O
TU R B
(25 O ON
%)
O RB TU
0 0 5
F OF
PT 100% PT 25%
10
15
20
25
AI03100
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
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Table 36. Example of PSD Typical Power Calculation at VCC = 5.0V (Turbo Mode On)
Conditions Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 45 PT = 45/182 = 24.7% = ON Calculation (using typical values) ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 2.5mA/MHz x Freq ALE + %SRAM x 1.5mA/MHz x Freq ALE + % PLD x 2mA/MHz x Freq PLD + #PT x 400A/PT) = 50A x 0.90 + 0.1 x (0.8 x 2.5mA/MHz x 4MHz + 0.15 x 1.5mA/MHz x 4MHz + 2mA/MHz x 8MHz + 45 x 0.4mA/PT) = 45A + 0.1 x (8 + 0.9 + 16 + 18mA) = 45A + 0.1 x 42.9 = 45A + 4.29mA = 4.34mA This is the operating power with no EEPROM WRITE or Flash memory Erase cycles. Calculation is based on IOUT = 0mA. = 10% = 90% = 8MHz = 4MHz = 80% = 15% = 5% (no additional power above base)
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Table 37. Example of PSD Typical Power Calculation at VCC = 5.0V (Turbo Mode Off)
Conditions Highest Composite PLD input frequency (Freq PLD) MCU ALE frequency (Freq ALE) % Flash memory Access % SRAM access % I/O access Operational Modes % Normal % Power-down Mode Number of product terms used (from fitter report) % of total product terms Turbo Mode = 45 PT = 45/182 = 24.7% = Off Calculation (using typical values) ICC total = Ipwrdown x %pwrdown + %normal x (ICC (ac) + ICC (dc)) = Ipwrdown x %pwrdown + % normal x (%flash x 2.5mA/MHz x Freq ALE + %SRAM x 1.5mA/MHz x Freq ALE + % PLD x (from graph using Freq PLD)) = 50A x 0.90 + 0.1 x (0.8 x 2.5mA/MHz x 4MHz + 0.15 x 1.5mA/MHz x 4MHz + 24mA) = 45A + 0.1 x (8 + 0.9 + 24) = 45A + 0.1 x 32.9 = 45A + 3.29mA = 3.34mA This is the operating power with no EEPROM WRITE or Flash memory Erase cycles. Calculation is based on IOUT = 0mA. = 10% = 90% = 8MHz = 4MHz = 80% = 15% = 5% (no additional power above base)
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MAXIMUM RATING
Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not imTable 38. Absolute Maximum Ratings
Symbol TSTG TLEAD VIO VCC VPP VESD Storage Temperature Lead Temperature during Soldering (20 seconds max.)1 Input and Output Voltage (Q = VOH or Hi-Z) Supply Voltage Device Programmer Supply Voltage Electrostatic Discharge Voltage (Human Body model) 2 -0.6 -0.6 -0.6 -2000 Parameter Min. -65 Max. 125 235 7.0 7.0 14.0 2000 Unit C C V V V V
plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
Note: 1. IPC/JEDEC J-STD-020A 2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 , R2=500 )
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DC AND AC PARAMETERS
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the MeasureTable 39. Operating Conditions (5V devices)
Symbol VCC TA Ambient Operating Temperature (Commercial) 0 70 C Supply Voltage Ambient Operating Temperature (Industrial) Parameter Min. 4.5 -40 Max. 5.5 85 Unit V C
ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters.
Table 40. Operating Conditions (3V devices)
Symbol VCC TA Ambient Operating Temperature (Commercial) 0 70 C Supply Voltage Ambient Operating Temperature (Industrial) Parameter Min. 3.0 -40 Max. 3.6 85 Unit V C
Table 41. AC Signal Letters for PLD Timings
A C D E G I L N P Q R S T W B M Address Input CEout Output Input Data E Input Internal WDOG_ON signal Interrupt Input ALE Input Reset Input or Output Port Signal Output Output Data WR, UDS, LDS, DS, IORD, PSEN Inputs Chip Select Input R/W Input Internal PDN Signal VSTBY Output Output Macrocell
Table 42. AC Signal Behavior Symbols for PLD Timings
t L H V X Z PW Time Logic Level Low or ALE Logic Level High Valid No Longer a Valid Logic Level Float Pulse Width
Note: Example: tAVLX = Time from Address Valid to ALE Invalid.
Note: Example: tAVLX = Time from Address Valid to ALE Invalid.
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Table 43. AC Measurement Conditions
Symbol CL Load Capacitance Parameter Min. 30 Max. Unit pF
Note: 1. Output Hi-Z is defined as the point where data out is no longer driven.
Table 44. Capacitance
Symbol CIN COUT CVPP Parameter Input Capacitance (for input pins) Output Capacitance (for input/ output pins) Capacitance (for CNTL2/VPP) Test Condition VIN = 0V VOUT = 0V VPP = 0V Typ.2 4 8 18 Max. 6 12 25 Unit pF pF pF
Note: 1. Sampled only, not 100% tested. 2. Typical values are for TA = 25C and nominal supply voltages.
Figure 38. AC Measurement I/O Waveform
Figure 39. AC Measurement Load Circuit
2.01 V
3.0V Test Point 0V
AI03103b
195 1.5V Device Under Test
CL = 30 pF (Including Scope and Jig Capacitance)
AI03104b
Figure 40. Switching Waveforms - Key
WAVEFORMS INPUTS OUTPUTS
STEADY INPUT
STEADY OUTPUT
MAY CHANGE FROM HI TO LO MAY CHANGE FROM LO TO HI
WILL BE CHANGING FROM HI TO LO WILL BE CHANGING LO TO HI
DON'T CARE
CHANGING, STATE UNKNOWN
OUTPUTS ONLY
CENTER LINE IS TRI-STATE
AI03102
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Table 45. DC Characteristics (5V devices)
Symbol VIH VIL VIH1 VIL1 VHYS VLKO Parameter Input High Voltage Input Low Voltage Reset High Level Input Voltage Reset Low Level Input Voltage Reset Pin Hysteresis VCC (min) for Flash Erase and Program IOL = 20A, VCC = 4.5V Output Low Voltage IOL = 8mA, VCC = 4.5V Output High Voltage Except VSTBY On Output High Voltage VSTBY On SRAM Stand-by Voltage SRAM Stand-by Current Idle Current (VSTBY input) SRAM Data Retention Voltage Stand-by Supply Current for Power-down Mode Input Leakage Current Output Leakage Current VCC = 0V VCC > VSTBY Only on VSTBY CSI >VCC -0.3V (Notes 2,3) VSS < VIN < VCC 0.45 < VOUT < VCC ZPLD_TURBO = Off, f = 0MHz (Note 5) ZPLD_TURBO = On, f = 0MHz During Flash memory or EEPROM WRITE/Erase Only Read only, f = 0MHz SRAM ZPLD AC Adder ICC (AC) (Note 5) Flash memory or EEPROM AC Adder SRAM AC Adder
Note: 1. 2. 3. 4. 5.
Test Condition (in addition to those in Table 39) 4.5V < VCC < 5.5V 4.5V < VCC < 5.5V (Note 1) (Note 1)
Min. 2 -0.5 0.8VCC -0.5 0.3 2.5
Typ.
Max. VCC +0.5 0.8 VCC +0.5 0.2VCC -0.1
Unit V V V V V
4.2 0.01 0.25 0.1 0.45
V V V V V V
VOL
VOH VOH1 VSTBY ISTBY IIDLE VDF ISB ILI ILO
IOH = -20A, VCC = 4.5V IOH = -2mA, VCC = 4.5V IOH1 = 1A
4.4 2.4 VSTBY - 0.8 2.0
4.49 3.9
VCC 0.5 1 0.1
V A A V
-0.1 2 50 -1 -10 0.1 5 0 400
200 1 10
A A A mA
ZPLD Only ICC (DC) (Note 5) Operating Supply Current
700
A/PT
Flash memory or EEPROM
15 0 0 See Figure 36, note 4 2.5 1.5
30 0 0
mA mA mA
f = 0MHz
3.5 3.0
mA/ MHz mA/ MHz
Reset (RESET) has hysteresis. VIL1 is valid at or below 0.2VCC -0.1. VIH1 is valid at or above 0.8VCC. CSI deselected or internal Power-down mode is active. PLD is in non-Turbo mode, and none of the inputs are switching. Please see Figure 36., page 73 for the PLD current calculation. IOUT = 0mA
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Table 46. DC Characteristics (3V devices)
Symbol VIH VIL VIH1 VIL1 VHYS VLKO Parameter High Level Input Voltage Low Level Input Voltage Reset High Level Input Voltage Reset Low Level Input Voltage Reset Pin Hysteresis VCC (min) for Flash Erase and Program IOL = 20A, VCC = 3.0V VOL Output Low Voltage IOL = 4mA, VCC = 3.0V Output High Voltage Except VSTBY On Output High Voltage VSTBY On SRAM Stand-by Voltage SRAM Stand-by Current Idle Current (VSTBY input) SRAM Data Retention Voltage Stand-by Supply Current for Power-down Mode Input Leakage Current Output Leakage Current VCC = 0V VCC > VSTBY Only on VSTBY CSI >VCC -0.3V (Notes 2) VSS < VIN < VCC 0.45 < VIN < VCC ZPLD_TURBO = Off, f = 0MHz (Note 3) ZPLD_TURBO = On, f = 0MHz During Flash memory or EEPROM WRITE/Erase Only Read only, f = 0MHz SRAM ZPLD AC Adder ICC (AC) (Note 3) Flash memory or EEPROM AC Adder SRAM AC Adder f = 0MHz See Figure 37., page 73 1.5 0.8 2.0 1.5 mA/ MHz mA/ MHz -1 -10 -0.1 2 25 0.1 5 0 200 400 100 1 10 IOH = -20A, VCC = 3.0V IOH = -1mA, VCC = 3.0V IOH1 = 1A 2.9 2.7 VSTBY - 0.8 2.0 0.5 VCC 1 0.1 0.15 2.99 2.8 0.45 V V V V V A A V A A A A/PT A/PT Conditions 3.0V < VCC < 3.6V 3.0V < VCC < 3.6V (Note 1) (Note 1) Min. 0.7VCC -0.5 0.8VCC -0.5 0.3 1.5 0.01 2.2 0.1 Typ. Max. VCC +0.5 0.8 VCC +0.5 0.2VCC -0.1 Unit V V V V V V V
VOH VOH1 VSTBY ISTBY IIDLE VDF ISB ILI ILO
ZPLD Only ICC (DC) (Note 3) Operating Supply Current
Flash memory or EEPROM
10 0 0
25 0 0
mA mA mA
Note: 1. Reset (RESET) has hysteresis. VIL1 is valid at or below 0.2VCC -0.1. VIH1 is valid at or above 0.8VCC. 2. CSI deselected or internal PD is active. 3. IOUT = 0mA
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Figure 41. Input to Output Disable / Enable
INPUT
tER INPUT TO OUTPUT ENABLE/DISABLE
tEA
AI02863
Figure 42. Combinatorial Timing PLD
CPLD INPUT tPD CPLD OUTPUT
ai09228
Table 47. CPLD Combinatorial Timing (5V devices)
-90 Symbol Parameter CPLD Input Pin/ Feedback to CPLD Combinatorial Output CPLD Input to CPLD Output Enable CPLD Input to CPLD Output Disable CPLD Register Clear or Preset Delay CPLD Register Clear or Preset Pulse Width CPLD Array Delay Any macrocell 20 16 Conditions Min tPD Max 25 Min Max 30 Min Max 32 -12 -15 Fast Turbo Slew PT 2 rate1 Aloc Off +2 + 10 -2 Unit
ns
tEA tER tARP tARPW tARD
26 26 26 24
30 30 30 29 18
32 32 33
+ 10 + 10 + 10 + 10
-2 -2 -2
ns ns ns ns ns
22
+2
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount. 2. ZPSD versions only.
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PSD813F1V
Table 48. CPLD Combinatorial Timing (3V devices)
-15 Symbol Parameter CPLD Input Pin/Feedback to CPLD Combinatorial Output CPLD Input to CPLD Output Enable CPLD Input to CPLD Output Disable CPLD Register Clear or Preset Delay CPLD Register Clear or Preset Pulse Width CPLD Array Delay Any macrocell 30 29 Conditions Min tPD Max 48 Min Max 55 -20 PT Aloc Turbo Off2 + 20 Slew rate1 -6 Unit
+4
ns
tEA tER tARP tARPW tARD
43 43 48 35
50 50 55
+ 20 + 20 + 20 + 20
-6 -6 -6
ns ns ns ns ns
33
+4
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount. 2. ZPSD versions only.
Figure 43. Synchronous Clock Mode Timing - PLD
tCH tCL
CLKIN
tS INPUT
tH
tCO REGISTERED OUTPUT
AI02860
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Table 49. CPLD Macrocell Synchronous Clock Mode Timing (5V devices)
-90 Symbol Parameter Maximum Frequency External Feedback Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data tS tH tCH tCL tCO tARD tMIN Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period 2 Clock Input Clock Input Clock Input Any macrocell tCH+tCL 20 Conditions Min Max 30.3 0 Min Max Min Max -12 -15 Fast Turbo Slew PT Off rate1 Aloc Unit
1/(tS+tCO)
26.3
23.8
MHz
fMAX
1/(tS+tCO-10)
43.4 8
35.7
31.25
MHz
1/(tCH+tCL)
50.0 0 15 0 10 10 18 16 24 18 0 12 12
41.67
33.3
MHz
20 0 15 15 20 18 30 22 22
+2
+ 10
ns ns ns ns -2 ns ns ns
+2
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. Decrement times by given amount. 2. CLKIN (PD1) tCLCL = tCH + tCL.
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PSD813F1V
Table 50. CPLD Macrocell Synchronous Clock Mode Timing (3V devices)
-15 Symbol Parameter Maximum Frequency External Feedback fMAX Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data tS tH tCH tCL tCO tARD tMIN Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period2 Clock Input Clock Input Clock Input Any macrocell tCH+tCL 29 Conditions Min 1/(tS+tCO) 1/(tS+tCO-10) 1/(tCH+tCL) 27 0 15 15 35 29 32 Max 17.8 19.6 33.3 35 0 16 16 39 33 +4 -6 Min Max 14.7 17.2 31.2 +4 + 20 -20 PT Aloc Turbo Off Slew rate1 Unit
MHz MHz MHz ns ns ns ns ns ns ns
Note: 1. Fast Slew Rate output available on PA3-PA0, PB3-PB0, and PD2-PD0. 2. CLKIN (PD1) tCLCL = tCH + tCL.
Figure 44. Asynchronous Reset / Preset
tARPW
RESET/PRESET INPUT tARP REGISTER OUTPUT
AI02864
Figure 45. Asynchronous Clock Mode Timing (Product Term Clock)
tCHA tCLA
CLOCK
tSA
tHA
INPUT tCOA REGISTERED OUTPUT
AI02859
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PSD813F1V
Table 51. CPLD Macrocell Asynchronous Clock Mode Timing (5V devices)
-90 Symbol Parameter Maximum Frequency External Feedback Maximum Frequency Internal Feedback (fCNTA) Maximum Frequency Pipelined Data tSA tHA tCHA tCLA tCOA tARDA tMINA Input Setup Time Input Hold Time Clock Input High Time Clock Input Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period Any macrocell 1/fCNTA 28 Conditions Min Max 26.3 2 Min Max Min Max -12 -15 PT Turbo Slew Aloc Off1 Rate Unit
1/(tSA+tCOA)
23.25
20.4
MHz
fMAXA
1/(tSA+tCOA-10)
35.7 1
30.30
25.64
MHz
1/(tCHA+tCLA)
41.6 7
35.71
33.3
MHz
8 12 12 12 30 16
10 14 14 14 33 18 33
12 14 15 15 37 22 39
+2
+ 10
ns ns
+ 10 + 10 + 10 +2 -2
ns ns ns ns ns
Note: 1. ZPSD versions only.
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PSD813F1V
Table 52. CPLD Macrocell Asynchronous Clock Mode Timing (3V devices)
-15 Symbol Parameter Maximum Frequency External Feedback fMAXA Maximum Frequency Internal Feedback (fCNTA) Maximum Frequency Pipelined Data tSA tHA tCHA tCLA tCOA tARD tMINA Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period Any macrocell 1/fCNTA 42 Conditions Min 1/(tSA+tCOA) Max 19.2 Min Max 16.9 -20 PT Turbo Slew Aloc Off1 Rate Unit
MHz
1/(tSA+tCOA-10)
23.8
20.4
MHz
1/(tCHA+tCLA) 12 15 22 15
27 13 17 25 16 40 29 49
24.4 +4 + 20
MHz ns ns + 20 + 20 ns ns -6 ns ns ns
46 33 +4
+ 20
Note: 1. ZPSD Versions only.
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PSD813F1V
Figure 46. Input Macrocell Timing (product term clock)
t INH
PT CLOCK
t INL
t IS
INPUT
t IH
OUTPUT
t INO
AI03101
Table 53. Input Macrocell Timing (5V devices)
-90 Symbol tIS tIH tINH tINL tINO Parameter Input Setup Time Input Hold Time NIB Input High Time NIB Input Low Time NIB Input to Combinatorial Delay Conditions Min (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) 0 20 12 12 46 Max Min 0 22 15 15 50 Max Min 0 26 18 18 59 +2 + 10 + 10 Max -12 -15 PT Aloc Turbo Off2 Unit ns ns ns ns ns
Note: 1. Inputs from Port A, B, and C relative to register/ latch clock from the PLD. ALE/AS latch timings refer to tAVLX and tLXAX. 2. ZPSD versions only.
Table 54. Input Macrocell Timing (3V Devices)
-15 Symbol tIS tIH tINH tINL tINO Parameter Input Setup Time Input Hold Time NIB Input High Time NIB Input Low Time NIB Input to Combinatorial Delay Conditions Min (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) 0 25 13 13 62 Max Min 0 30 15 15 70 +4 + 20 + 20 Max -20 PT Aloc Turbo Off2 Unit ns ns ns ns ns
Note: 1. Inputs from Port A, B, and C relative to register/latch clock from the PLD. ALE latch timings refer to tAVLX and tLXAX. 2. ZPSD Versions only.
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Figure 47. READ Timing
tAVLX ALE /AS tLVLX A /D MULTIPLEXED BUS ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLQV CSI tRLQV tRLRH RD (PSEN, DS) tRHQZ tRHQX ADDRESS VALID tAVQV ADDRESS VALID DATA VALID tLXAX
1
DATA VALID
tEHEL E tTHEH tELTL
R/W
tAVPV ADDRESS OUT
AI02895
Note: 1. tAVLX and tLXAX are not required for 80C251 in Page Mode or 80C51XA in Burst Mode.
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Table 55. READ Timing (5V devices)
-90 Symbol tLVLX tAVLX tLXAX tAVQV tSLQV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Data Valid CS Valid to Data Valid RD to Data Valid 8-Bit Bus tRLQV RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251 RD Data Hold Time RD Pulse Width RD to Data High-Z E Pulse Width R/W Setup Time to Enable R/W Hold Time After Enable Address Input Valid to Address Output Delay (Note 4) (Note 5) (Note 2) (Note 1) (Note 1) (Note 1) 32 10 0 25 0 32 25 36 13 0 28 (Note 3) (Note 3) (Notes 3,6) Conditions Min 20 6 8 90 100 32 38 0 35 35 38 18 0 32 Max Min 22 8 9 120 135 35 42 0 38 38 Max Min 28 10 11 150 150 40 45 + 10 Max -12 -15 Turbo Off Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns
tRHQX tRLRH tRHQZ tEHEL tTHEH tELTL tAVPV
Note: 1. 2. 3. 4. 5. 6.
RD timing has the same timing as DS, LDS, UDS, and PSEN signals. RD and PSEN have the same timing. Any input used to select an internal PSD function. In multiplexed mode, latched addresses generated from ADIO delay to address output on any Port. RD timing has the same timing as DS, LDS, and UDS signals. In Turbo Off mode, add 10ns to tAVQV.
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Table 56. READ Timing (3V devices)
-15 Symbol tLVLX tAVLX tLXAX tAVQV tSLQV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Data Valid CS Valid to Data Valid RD to Data Valid 8-Bit Bus tRLQV RD or PSEN to Data Valid 8-Bit Bus, 8031, 80251 RD Data Hold Time RD Pulse Width (also DS, LDS, UDS) tRLRH tRHQZ tEHEL tTHEH tELTL tAVPV
Note: 1. 2. 3. 4. 5. 6.
-20 Max Min 30 12 14 150 150 200 200 40 55 0 45 60 40 45 52 20 0 Max
Conditions Min 26 (Note 3) (Note 3) (Note 3,6) 10 12
Turbo Off
Unit ns ns ns
+ 20
ns ns ns ns ns ns ns ns ns ns ns
(Note 5) (Note 2) (Note 1) 0 40 55 (Note 1) 45 18 0 (Note 4)
35 50
tRHQX
RD or PSEN Pulse Width (8031, 80251) RD to Data High-Z E Pulse Width R/W Setup Time to Enable R/W Hold Time After Enable Address Input Valid to Address Output Delay
35
40
ns
RD timing has the same timing as DS, LDS, UDS, and PSEN signals. RD and PSEN have the same timing for 8031. Any input used to select an internal PSD function. In multiplexed mode latched address generated from ADIO delay to address output on any Port. RD timing has the same timing as DS, LDS, and UDS signals. In Turbo Off mode, add 20ns to tAVQV.
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PSD813F1V
Figure 48. WRITE Timing
tAVLX ALE/AS t LVLX A/D MULTIPLEXED BUS ADDRESS VALID tAVWL ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLWL CSI tDVWH WR (DS) t WLWH t WHDX t WHAX ADDRESS VALID DATA VALID DATA VALID t LXAX
t EHEL E t THEH R/ W t WLMV tAVPV ADDRESS OUT t WHPV STANDARD MCU I/O OUT t ELTL
AI02896
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Table 57. WRITE, Erase and Program Timing (5V devices)
-90 Symbol tLVLX tAVLX tLXAX tAVWL tSLWL tDVWH tWHDX tWLWH tWHAX1 tWHAX2 tWHPV Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Leading Edge of WR CS Valid to Leading Edge of WR WR Data Setup Time WR Data Hold Time WR Pulse Width Trailing Edge of WR to Address Invalid Trailing Edge of WR to DPLD Address Invalid Trailing Edge of WR to Port Output Valid Using I/O Port Data Register Data Valid to Port Output Valid Using Macrocell Register Preset/Clear Address Input Valid to Address Output Delay WR Valid to Port Output Valid Using Macrocell Register Preset/Clear (Note 1) (Note 1) (Notes 1,3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3,6) (Note 3) Conditions Min 20 6 8 15 15 35 5 35 8 0 30 Max Min 22 8 9 18 18 40 5 40 9 0 35 Max Min 28 10 11 20 20 45 5 45 10 0 38 Max ns ns ns ns ns ns ns ns ns ns ns -12 -15 Unit
tDVMV
(Notes 3,5) (Note 2) (Notes 3,4)
55
60
65
ns
tAVPV tWLMV
Note: 1. 2. 3. 4. 5. 6.
25 55
28 60
30 65
ns ns
Any input used to select an internal PSD function. In multiplexed mode, latched address generated from ADIO delay to address output on any port. WR has the same timing as E, LDS, UDS, WRL, and WRH signals. Assuming data is stable before active WRITE signal. Assuming WRITE is active before data becomes valid. TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory.
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Table 58. WRITE Timing (3V devices)
-15 Symbol tLVLX tAVLX tLXAX tAVWL tSLWL tDVWH tWHDX tWLWH tWHAX1 tWHAX2 tWHPV tDVMV tAVPV tWLMV
Note: 1. 2. 3. 4. 5. 6.
-20 Unit Max Min 30 12 14 25 25 50 10 53 17 0 45 90 48 90 50 100 55 100 ns ns ns ns ns ns ns ns ns ns ns ns ns Max
Parameter ALE or AS Pulse Width Address Setup Time Address Hold Time Address Valid to Leading Edge of WR CS Valid to Leading Edge of WR WR Data Setup Time WR Data Hold Time WR Pulse Width Trailing Edge of WR to Address Invalid Trailing Edge of WR to DPLD Address Invalid Trailing Edge of WR to Port Output Valid Using I/O Port Data Register Data Valid to Port Output Valid Using Macrocell Register Preset/Clear Address Input Valid to Address Output Delay WR Valid to Port Output Valid Using Macrocell Register Preset/Clear
Conditions Min 26 (Note 1) (Note 1) (Notes 1,3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3) (Note 3,6) (Note 3) (Notes 3,5) (Note 2) (Notes 3,4) 10 12 20 20 45 8 48 12 0
Any input used to select an internal PSD function. In multiplexed mode, latched address generated from ADIO delay to address output on any port. WR has the same timing as E, LDS, UDS, WRL, and WRH signals. Assuming data is stable before active WRITE signal. Assuming WRITE is active before data becomes valid. TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal PSD memory.
Table 59. Flash Program, WRITE and Erase Times (5V devices)
Symbol Flash Program Flash Bulk Erase (pre-programmed) Flash Bulk Erase (not pre-programmed) tWHQV3 tWHQV2 tWHQV1 Sector Erase (pre-programmed) Sector Erase (not pre-programmed) Byte Program Program / Erase Cycles (per Sector) tWHWLO tQ7VQV Sector Erase Time-Out DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2 100,000 100 30
1
Parameter
Min.
Typ. 8.5 3 10 1 2.2 14
Max.
Unit s
30
s s
30
s s
1200
s cycles s ns
Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
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Table 60. Flash Program, WRITE and Erase Times (3V devices)
Symbol Flash Program Flash Bulk Erase1 (pre-programmed) Flash Bulk Erase (not pre-programmed) tWHQV3 tWHQV2 tWHQV1 Sector Erase (pre-programmed) Sector Erase (not pre-programmed) Byte Program Program / Erase Cycles (per Sector) tWHWLO tQ7VQV Sector Erase Time-Out DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)
2
Parameter
Min.
Typ. 8.5 3 10 1 2.2 14
Max.
Unit s
30
s s
30
s s
1200
s cycles
100,000 100 30
s ns
Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
Table 61. EEPROM WRITE Times (5V devices)
Symbol tEEHWL tBLC tWCB tWCP Parameter Write Protect After Power Up EEPROM Byte Load Cycle Timing (Note 1) EEPROM Byte Write Cycle Time EEPROM Page Write Cycle Time (Note 2) Program/Erase Cycles (Per Sector) 10,000 0.2 4 6 Min Typ 5 120 10 30 Max Unit ms s ms ms cycles
Note: 1. If the maximum time has elapsed between successive WRITE cycles to an EEPROM page, the transfer of this data to EEPROM cells will begin. Also, bytes cannot be written (loaded) to a page any faster than the indicated minimum type. 2. These specifications are for writing a page to EEPROM cells.
Table 62. EEPROM WRITE Times (3V devices)
Symbol tEEHWL tBLC tWCB tWCP Parameter Write Protect After Power Up EEPROM Byte Load Cycle Timing (Note 1) EEPROM Byte Write Cycle Time EEPROM Page Write Cycle Time (Note 2) Program/Erase Cycles (Per Sector) 10,000 0.2 4 6 Min Typ 5 120 10 30 Max Unit ms s ms ms cycles
Note: 1. If the maximum time has elapsed between successive WRITE cycles to an EEPROM page, the transfer of this data to EEPROM cells will begin. Also, bytes cannot be written (loaded) to a page any faster than the indicated minimum type. 2. These specifications are for writing a page to EEPROM cells.
94/110
PSD813F1V
Figure 49. Peripheral I/O Read Timing
ALE/AS
A/D BUS
ADDRESS
DATA VALID
tAVQV (PA) tSLQV (PA) CSI tRLQV (PA) RD tRLRH (PA) tQXRH (PA) tRHQZ (PA)
tDVQV (PA) DATA ON PORT A
AI02897
Table 63. Port A Peripheral Data Mode READ Timing (5V devices)
-90 Symbol tAVQV-PA tSLQV-PA tRLQV-PA tDVQV-PA tQXRH-PA tRLRH-PA tRHQZ-PA Parameter Address Valid to Data Valid CSI Valid to Data Valid RD to Data Valid RD to Data Valid 8031 Mode Data In to Data Out Valid RD Data Hold Time RD Pulse Width RD to Data High-Z (Note 1) (Note 1) 0 32 25 (Notes 1,4) Conditions Min (Note 3) Max 40 35 32 38 30 0 35 28 Min Max 45 40 35 42 35 0 38 30 Min Max 45 45 40 45 38 -12 -15 Turbo Off + 10 + 10 Unit ns ns ns ns ns ns ns ns
Table 64. Port A Peripheral Data Mode READ Timing (3V devices)
-15 Symbol tAVQV-PA tSLQV-PA tRLQV-PA RD to Data Valid 8031 Mode tDVQV-PA tQXRH-PA tRLRH-PA tRHQZ-PA Data In to Data Out Valid RD Data Hold Time RD Pulse Width RD to Data High-Z (Note 1) (Note 1) 0 36 40 Parameter Address Valid to Data Valid CSI Valid to Data Valid RD to Data Valid (Notes 1,4) Conditions Min (Note 3) Max 55 45 40 45 60 0 46 45 Min Max 60 50 45 50 65 -20 Turbo Off + 20 + 20 Unit ns ns ns ns ns ns ns ns
95/110
PSD813F1V
Figure 50. Peripheral I/O WRITE Timing
ALE/AS
A / D BUS
ADDRESS
DATA OUT
tWLQV WR
(PA)
tWHQZ (PA)
tDVQV (PA) PORT A DATA OUT
AI02898
Table 65. Port A Peripheral Data Mode WRITE Timing (5V devices)
-90 Symbol tWLQV-PA tDVQV-PA tWHQZ-PA
Note: 1. 2. 3. 4. 5.
-12 Max 38 35 30
-15 Unit Min Max 40 38 33 ns ns ns
Parameter WR to Data Propagation Delay Data to Port A Data Propagation Delay WR Invalid to Port A Tri-state
Conditions Min (Note 2) (Note 5) (Note 2) Max Min 35 30 25
RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode). WR has the same timing as the E, LDS, UDS, WRL, and WRH signals. Any input used to select Port A Data Peripheral mode. Data is already stable on Port A. Data stable on ADIO pins to data on Port A.
Table 66. Port A Peripheral Data Mode WRITE Timing (3V devices)
-15 Symbol tWLQV-PA tDVQV-PA tWHQZ-PA
Note: 1. 2. 3. 4. 5.
-20 Unit Max 45 40 33 Min Max 55 45 35 ns ns ns
Parameter WR to Data Propagation Delay Data to Port A Data Propagation Delay WR Invalid to Port A Tri-state
Conditions Min (Note 2) (Note 5) (Note 2)
RD has the same timing as DS, LDS, UDS, and PSEN (in 8031 combined mode) signals. WR has the same timing as the E, LDS, UDS, WRL, and WRH signals. Any input used to select Port A Data Peripheral mode. Data is already stable on Port A. Data stable on ADIO pins to data on Port A.
96/110
PSD813F1V
Figure 51. Reset (RESET) Timing
VCC
VCC(min) tNLNH tNLNH-A Warm Reset
tNLNH-PO Power-On Reset
tOPR
tOPR
RESET
AI02866b
Table 67. Reset (RESET) Timing (5V devices)
Symbol tNLNH tNLNH-PO tOPR Parameter RESET Active Low Time 1 Power On Reset Active Low Time RESET High to Operational Device Conditions Min 150 1 120 Max Unit ns ms ns
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. 2. Warm reset aborts Flash memory Program or Erase cycles, and puts the device in READ Mode.
Table 68. Reset (RESET) Timing (3V devices)
Symbol tNLNH tNLNH-PO tOPR Parameter RESET Active Low Time 1 Power On Reset Active Low Time2 RESET High to Operational Device Conditions Min 300 1 300 Max Unit ns ms ns
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. 2. tNLNH-PO is 10ms for devices manufactured before the rev.A.
Table 69. VSTBYON Timing (5V devices)
Symbol tBVBH tBXBL Parameter VSTBY Detection to VSTBYON Output High VSTBY Off Detection to VSTBYON Output Low Conditions (Note 1) (Note 1) Min Typ 20 20 Max Unit s s
Table 70. VSTBYON Timing (3V devices)
Symbol tBVBH tBXBL Parameter VSTBY Detection to VSTBYON Output High VSTBY Off Detection to VSTBYON Output Low Conditions (Note 1) (Note 1) Min Typ 2.0 2.0 Max Unit s s
97/110
PSD813F1V
Figure 52. ISC Timing
t ISCCH
TCK
t ISCCL t ISCPSU t ISCPH
TDI/TMS
t ISCPZV t ISCPCO
ISC OUTPUTS/TDO
t ISCPVZ
ISC OUTPUTS/TDO
AI02865
Table 71. ISC Timing (5V devices)
-90 Symbol Parameter Clock (TCK, PC1) Frequency (except for PLD) Clock (TCK, PC1) High Time (except for PLD) Clock (TCK, PC1) Low Time (except for PLD) Clock (TCK, PC1) Frequency (PLD only) Clock (TCK, PC1) High Time (PLD only) Clock (TCK, PC1) Low Time (PLD only) ISC Port Set Up Time ISC Port Hold Up Time ISC Port Clock to Output ISC Port High-Impedance to Valid Output ISC Port Valid Output to High-Impedance Conditions Min tISCCF tISCCH tISCCL tISCCFP tISCCHP tISCCLP tISCPSU tISCPH tISCPCO tISCPZV tISCPVZ (Note 1) (Note 1) (Note 1) (Note 2) (Note 2) (Note 2) 240 240 8 5 23 23 23 26 26 2 240 240 10 5 24 24 24 Max Min 18 29 29 2 240 240 10 5 25 25 25 Max 16 31 31 2 Min Max 14 MHz ns ns MHz ns ns ns ns ns ns ns -12 -15 Unit
Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode. 2. For Program or Erase PLD only.
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PSD813F1V
Table 72. ISC Timing (3V devices)
-15 Symbol Parameter Clock (TCK, PC1) Frequency (except for PLD) Clock (TCK, PC1) High Time (except for PLD) Clock (TCK, PC1) Low Time (except for PLD) Clock (TCK, PC1) Frequency (PLD only) Clock (TCK, PC1) High Time (PLD only) Clock (TCK, PC1) Low Time (PLD only) ISC Port Set Up Time ISC Port Hold Up Time ISC Port Clock to Output ISC Port High-Impedance to Valid Output ISC Port Valid Output to High-Impedance Conditions Min tISCCF tISCCH tISCCL tISCCFP tISCCHP tISCCLP tISCPSU tISCPH tISCPCO tISCPZV tISCPVZ (Note 1) (Note 1) (Note 1) (Note 2) (Note 2) (Note 2) 240 240 13 10 36 36 36 45 45 2 240 240 15 10 40 40 40 Max 10 51 51 2 Min Max 9 MHz ns ns MHz ns ns ns ns ns ns ns -20 Unit
Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode. 2. For Program or Erase PLD only.
Table 73. Power-down Timing (5V devices)
-90 Symbol tLVDV tCLWH Parameter ALE Access Time from Power-down Maximum Delay from APD Enable to Internal PDN Valid Signal Using CLKIN (PD1) Conditions Min Max Min 90 Max 120 15 * tCLCL1 Min Max 150 ns s -12 -15 Unit
Note: 1. tCLCL is the period of CLKIN (PD1).
Table 74. Power-down Timing (3V devices)
-15 Symbol tLVDV tCLWH Parameter ALE Access Time from Power-down Maximum Delay from APD Enable to Internal PDN Valid Signal Using CLKIN (PD1) Conditions Min Max 150 15 * tCLCL1 Min Max 200 ns s -20 Unit
Note: 1. tCLCL is the period of CLKIN (PD1).
99/110
PSD813F1V
PACKAGE MECHANICAL
Figure 53. PQFP52 - 52-pin Plastic, Quad, Flat Package Mechanical Drawing
D D1 D2 A2
e Ne E2 E1 E b
N 1
Nd L1
A CP
c
QFP-A
Note: Drawing is not to scale.
A1
L
100/110
PSD813F1V
Table 75. PQFP52 - 52-pin Plastic, Quad, Flat Package Mechanical Dimensions
mm Symb. Typ. A A1 A2 b c D D1 D2 E E1 E2 e L L1 N Nd Ne CP 13.20 10.00 7.80 13.20 10.00 7.80 0.65 0.88 1.60 2.00 1.80 0.22 0.11 13.15 9.95 - 13.15 9.95 - - 0.73 - 0 52 13 13 0.10 Min. Max. 2.35 0.25 2.10 0.38 0.23 13.25 10.05 - 13.25 10.05 - - 1.03 - 7 0.520 0.394 0.307 0.520 0.394 0.307 0.026 0.035 0.063 0 52 13 13 0.004 7 0.029 0.041 0.079 0.077 0.009 0.004 0.518 0.392 - 0.518 0.392 - Typ. Min. Max. 0.093 0.010 0.083 0.015 0.009 0.522 0.396 - 0.522 0.396 - inches
101/110
PSD813F1V
Figure 54. PLCC52 - 52-lead Plastic Lead, Chip Carrier Package Mechanical Drawing
D D1 M
1N
A1 A2 M1
b1
E1 E
D2/E2 D3/E3 b L1 L C A CP
e
PLCC-B
Note: Drawing is not to scale.
Table 76. PLCC52 - 52-lead Plastic Lead, Chip Carrier Package Mechanical Dimensions
mm Symbol Typ. A A1 A2 B B1 C D D1 D2 E E1 E2 e R N Nd Ne 1.27 0.89 Min. 4.19 2.54 - 0.33 0.66 0.246 19.94 19.05 17.53 19.94 19.05 17.53 - - 52 13 13 Max. 4.57 2.79 0.91 0.53 0.81 0.261 20.19 19.15 18.54 20.19 19.15 18.54 - - 0.050 0.035 Typ. Min. 0.165 0.100 - 0.013 0.026 0.0097 0.785 0.750 0.690 0.785 0.750 0.690 - - 52 13 13 Max. 0.180 0.110 0.036 0.021 0.032 0.0103 0.795 0.754 0.730 0.795 0.754 0.730 - - inches
102/110
PSD813F1V
Figure 55. TQFP64 - 64-lead Thin Quad Flatpack, Package Outline
D D1 D2 A2
e Ne E2 E1 E b
N 1
Nd L1
A CP
c
QFP-A
Note: Drawing is not to scale.
A1
L
103/110
PSD813F1V
Table 77. TQFP64 - 64-lead Thin Quad Flatpack, Package Mechanical Data
mm Symb. Typ. A A1 A2 b c D D1 D2 E E1 E2 e L L1 CP N Nd Ne 16.00 14.00 12.00 16.00 14.00 12.00 0.80 0.60 1.00 0.10 64 16 16 15.90 13.98 11.95 15.90 13.98 11.95 0.75 0.45 0.94 0.10 1.40 3.5 0.35 Min. 1.42 0.07 1.36 0.0 0.33 Max. 1.54 0.14 1.44 7.0 0.38 0.17 16.10 14.03 12.05 16.10 14.03 12.05 0.85 0.75 1.06 0.630 0.551 0.472 0.630 0.551 0.472 0.031 0.024 0.039 0.004 64 16 16 0.626 0.550 0.470 0.626 0.550 0.470 0.030 0.018 0.037 0.004 0.055 3.5 0.014 Typ. Min. 0.056 0.003 0.054 0.0 0.013 Max. 0.061 0.005 0.057 7.0 0.015 0.006 0.634 0.552 0.474 0.634 0.552 0.474 0.033 0.030 0.042 inches
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PART NUMBERING
Table 78. Ordering Information Scheme
Example: PSD8 1 3 F 1 A - 15 J 1 T
Device Type PSD8 = 8-bit PSD with Register Logic
SRAM Capacity 1 = 16 Kbit
Flash Memory Capacity 3 = 1 Mbit (128Kb x 8)
2nd Flash Memory 1 = 256 Kbit EEPROM
Operating Voltage V = VCC = 3.0 to 3.6V
Speed 70 = 70ns 90 = 90ns 12 = 120ns
Package J = PLCC52 M = PQFP52 U = TQFP64
Temperature Range blank = 0 to 70C (commercial) I = -40 to 85C (industrial)
Option T = Tape & Reel Packing
For other options, or for more information on any aspect of this device, please contact the ST Sales Office nearest you.
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APPENDIX A. PQFP52 PIN ASSIGNMENTS
Table 79. PQFP52 Connections (Figure 2)
Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Pin Assignments PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 PC1 PC0 PA7 PA6 PA5 PA4 PA3 GND PA2 PA1 PA0 AD0 AD1 AD2 AD3 Pin Number 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 Pin Assignments AD4 AD5 AD6 AD7 VCC AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 CNTL0 RESET CNTL2 CNTL1 PB7 PB6 GND PB5 PB4 PB3 PB2 PB1 PB0
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APPENDIX B. PLCC52 PIN ASSIGNMENTS
Table 80. PLCC52 Connections (Figure 3)
Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Pin Assignments GND PB5 PB4 PB3 PB2 PB1 PB0 PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 (VSTBY) PC1 PC0 PA7 PA6 PA5 PA4 PA3 GND Pin Number 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 Pin Assignments PA2 PA1 PA0 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 VCC AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 CNTL0 RESET CNTL2 CNTL1 PB7 PB6
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APPENDIX C. TQFP64 PIN ASSIGNMENTS
Table 81. TQFP64 Connections (Figure 4)
Pin Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 Pin Assignments PD2 PD1 PD0 PC7 PC6 PC5 VCC VCC VCC GND GND PC3 PC2 PC1 PC0 NC NC NC PA7 PA6 PA5 PA4 PA3 GND GND PA2 PA1 PA0 AD0 AD1 N/D AD2 Pin Number 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Pin Assignments AD3 AD4 AD5 AD6 AD7 VCC VCC AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 CNTL0 NC RESET CNTL2 CNTL1 PB7 PB6 GND GND PB5 PB4 PB3 PB2 PB1 PB0 NC NC
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REVISION HISTORY
Table 82. Document Revision History
Date August-2000 04-Jan-03 06-Dec-03 3-Jun-04 Rev. 1.0 1.1 2.0 3.0 Document written in WSI format. Front page, and back two pages, in ST format, added to the PDF file. References to Waferscale, WSI, EasyFLASH and PSDsoft 2000 updated to ST, ST, Flash+PSD and PSDsoft Express. Document converted to ST format. Package references corrected (Figure 1). Document reformatted for DMS; Ordering Information corrected (Table 78); added TQFP64 package (Figure 1, 55; Table 77) Description of Revision
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequ of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is g by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are s to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products a authorized for use as critical components in life support devices or systems without express written approval of STMicroelectron The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States www.st.com
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